Sun Sets New World Records With Enhanced UltraSPARC IV+ Servers Running Solaris

Sun Microsystems, Inc. (NASDAQ: SUNW) today announced the availability of faster 1.95GHz and 2.1GHz UltraSPARC(R) IV+ processors for its popular Sun Fire servers. New Sun Fire servers with UltraSPARC IV+ 1.95GHz and 2.1GHz processors offer world record performance, easy application portability and industry leading investment protection. The new servers are powered by the Solaris Operating System (OS), which delivers customers unbroken binary compatibility, thus ensuring that existing applications will run on the new UltraSPARC IV+ processors without the need to re-code or re-compile.


According to industry analyst reports, Sun has gained market share for four consecutive quarters. SPARC-based systems represent a significant portion of that growth and the new 1.95GHz and 2.1 GHz UltraSPARC IV+ processors demonstrate Sun's ongoing commitment to improving the performance of the SPARC architecture and the protection of customer investment.

"SPARC, with Solaris, is the engine that drives our server business, and we're committed to continual improvements on our SPARC-based products," said John Fowler, executive vice president, Systems Group, Sun Microsystems. "The growing demand for UltraSPARC IV+ servers has helped Sun build tremendous market momentum in our systems line-up, and steal significant market share at the expense of our competitors."

Sun Sets New World Records

The Sun Fire E2900 with UltraSPARC IV+ 1.95 GHz (US-IV+1.95GHz) set a new world-record for a single application server, with a Sun Fire T2000 as the database server, on SPECjAppServer2004 achieving >1781 JOPS - the highest 2-node result performance record to date. The Sun Fire (US-IV+1.95GHz) uses six Solaris containers which - through consolidation - improves datacenter efficiency and promotes higher levels of system utilization.1

The Sun Fire E6900 (24 processors, 48 cores, 48 threads) with UltraSPARC IV+ 1.95GHz set a new world-record for the SAP-SD 2-Tier Standard Application benchmark for systems with 24 or fewer processors as of 04/02/07, achieving 6160 users.2

Sun Fire UltraSPARC IV+ servers now own over 75 world-record benchmarks.

The Sun Fire V490, V890, E2900, E4900, E6900, E20K and E25K servers, powered by new 1.95GHz and 2.1GHz UltraSPARC IV+ processors have up to 2x the life of comparable IBM servers and up to 1/3 better TCO.

When compared to previous generations, the new UltraSPARC IV+ processor has shown 2X performance over the UltraSPARC IV and 5X performance over the UltraSPARC III.

Sun Fire UltraSPARC platforms are designed to help customers with CRM, business intelligence/data warehousing, and enterprise applications using large databases. The systems are ideal for virtualization environments using a combination of fault isolated hard partitions and flexible Solaris Containers. Solaris 10 Containers can consolidate and virtualize hundreds of applications on a single system so customers save in energy, space and complexity. Solaris Container management is superior to HP and IBM partitioning strategies as it requires less overhead, while providing resource flexibility down to a single processor.

For more information on Sun's UltraSPARC IV+ processor line, please visit: http://www.sun.com/servers/index.jsp?cat=Sun%20Fire%20Midrange%20Servers&tab=3&subcat=Sun%20UltraSPARC%20IV%2b/IV



About Sun Microsystems, Inc.
A singular vision -- "The Network Is The Computer" -- guides Sun in the development of technologies that power the world's most important markets. Sun's philosophy of sharing innovation and building communities is at the forefront of the next wave of computing: the Participation Age. Sun can be found in more than 100 countries and on the Web at http://sun.com

Sun, Sun Microsystems, the Sun logo, Sun Fire, UltraSPARC, Solaris, and the Network is the Computer are trademarks or registered trademarks of Sun Microsystems, Inc. in the United States and in other countries. All SPARC trademarks are used under license and are trademarks or registered trademarks of SPARC International, Inc. in the US and other countries. Products bearing SPARC trademarks are based upon an architecture developed by Sun Microsystems, Inc.

1. SPECjAppServer2004
1 Sun Fire E2900 (24 cores, 12 chips) and 1 Sun Fire T2000 (8 cores, 1 chip) 1781.37 SPECjAppServer2004 JOPS@Standard.
6 HP DL380 (12 cores, 12 chips) and 1 HP rx8620 (16 cores, 16 chips) 1664.36 SPECjAppServer2004 JOPS@Standard.
5 IBM xSeries 365 (20 cores, 20 chips) and 2 IBM xSeries 365 (8 cores, 8 chips) 1343.47
SPECjAppServer2004 JOPS@Standard.
1 HP rx6600 (8 cores, 4 chips) and 1 HP rx8620 (16 cores, 16 chips) 1266.42 SPECjAppServer2004 JOPS@Standard.
5 Sun Fire X4100 (20 cores, 10 chips) and 1 Sun Fire E6900 (32 cores, 16 chips) 1781.47
SPECjAppServer2004 JOPS@Standard.
SPEC, SPECjAppServer reg tm of Standard Performance Evaluation Corporation.
Results from www.spec.org as of 04/03/2007

2. Two-tier SAP Sales and Distribution (SD) standard SAP ERP 2004/2005 application benchmark: Sun Fire E6900, 24 processors / 48 cores / 48 threads, UltraSPARC IV+, 1950 MHz, 128 KB(D) + 128 KB(I) L1 cache, 2 MB L2 cache on-chip, 32 MB L3 cache off-chip, 96 GB main memory. Number of benchmark users & comp.: 6,160 SD (Sales & Distribution) Average dialog response time: 1.99 seconds Throughput: Fully Processed Order Line items/hour: 616,330 Dialog steps/hour: 1,849,000 SAPS: 30,820 Average DB request time (dia/upd): 0.018 sec / 0.033 sec CPU utilization of central server: 99% Operating System central server: Solaris 10 RDBMS: Oracle 10g SAP ECC Release: 6.0. The SAP certification number was not available at press time and can be found at the following Web page: www.sap.com/benchmark

HP Integrity Superdome-16 (16 processors, 32 cores, 64 threads) 16 x 1.6 GHz Dual-Core Intel Itanium 2 9050, 256GB memory, 5,600 SD benchmark users, 1.91s avg resp time, Cert#2006090, SQL Server 2005, Windows Server 2003 Datacenter Edition; Unisys Enterprise Server Model ES7000/one (16 processors, 32 cores, 64 threads) 16 x 1.6 GHz Dual-Core

Intel Itanium 2 9050, 256GB memory, 4,884 SD benchmark users, 1.93s avg resp time, Cert#2006091, SQL Server 2005, Windows Server 2003 Datacenter Edition; IBM System p5 570 (16 processors, 16 cores, 32 threads) 16 x 2.2 GHz POWER5+, 128 GB memory, 5,520 SD benchmark users, 1.97s avg resp time, Cert#2006044, DB2 UDB 8.2.2, AIX 5.3; Fujitsu PRIMEQUEST 480 (32 procs, 32 cores, 32 threads) 32 x 1.6 GHz Intel Itanium 2, 256 GB memory, 5,000 SD benchmark users, 1.97s avg resp time, Cert#2006023, Oracle 9i, SuSE Linux Enterprise Server 9;SAP, R/3, mySAP reg TM of SAP AG in Germany and other countries. More info www.sap.com/benchmark.

Cisco Completes Acquisition of NeoPath Networks

Cisco (NASDAQ: CSCO) today announced it has completed the acquisition of privately-held NeoPath Networks, the leading provider of high performance and highly scalable file storage management solutions.

NeoPath's patented SMART virtualization technology and its File DirectorTM family of products simplify the management of network attached storage (NAS) and other file servers.

With the close of the transaction, the NeoPath team and product portfolio are now integrated into the Datacenter Switching and Security Technology Group (DSSTG), reporting up into Jayshree Ullal, Senior Vice President.

HP Appoints Nor Rae Spohn to Lead LaserJet Printing Business

HP today announced the appointment of Nor Rae Spohn to senior vice president of the company’s LaserJet Printing Business.

Spohn, 49, will be responsible for continuing HP’s worldwide leadership in laser printing through customer focus and innovation.

A 26-year veteran of HP, Spohn will report to Vyomesh Joshi, executive vice president of HP’s Imaging and Printing Group (IPG).

“Nor Rae is a natural leader with a deep understanding of HP’s Imaging and Printing business,” said Joshi. “Her distinguished leadership track record makes her a natural fit for this role and I look forward to her continued contributions as a key member of the IPG leadership team.”

Previously, Spohn was vice president and general manager of the HP Color LaserJet Business and before that led the HP Personal LaserJet Printing Business. Last October, she was inducted in the Women in Technology International Hall of Fame as one of the world’s “five most pioneering women.”

Based in Boise, Idaho, Spohn recently was appointed to the Governor of Idaho’s Science and Technology Advisory Council. She holds a bachelor’s degree from Iowa State University in computer science and a master’s degree from Stanford in electrical engineering.

AMD Imageon Media Processor Drives Multimedia Technology Behind Avant-Garde New PRADA Phone by LG

AMD (NYSE: AMD) today announced that powerful AMD multimedia technology is concealed behind the sleek, elegant exterior of the new touch-screen PRADA phone by LG Electronics Mobile Communications.

Despite an ultra-thin profile of just 12 mm, the model KE850 PRADA phone by LG features such multimedia functions as a camera, video player and MP3 music player, all of which are driven by the processing power of the AMD Imageon™ 2282 media processor. To further enhance the user experience, this new GSM/ EDGE phone introduces a unique advanced touch interface that completely eliminates the conventional keypad.

“Today’s consumers expect the most advanced technology on their mobile devices, and we work closely with leading global OEMs like LG to help them meet those demands as competitively as possible,” said Paul Dal Santo, vice president and general manager of AMD’s Handheld Division. “The new PRADA phone by LG offers a beautiful blend of style and performance, packed with the kind of cutting-edge multimedia that consumers crave.”

“Building on our expertise as a leader in both consumer electronics and mobile communications, we set out to design a unique work of art with style and appeal,” said Alice Ryu, vice president of LG Electronics Mobile Communications.

To enable the best possible experience for viewing videos, photos and documents, the PRADA phone by LG features an advanced, extra-wide 3” WQVGA-resolution touch screen interface that covers much of the phone’s surface. Additional features that set this mobile phone design apart from the ordinary include a 2 Mpixel camera with a Schneider-Kreuznach lens, a video player and an external memory slot.

The model KE850 PRADA phone by LG is expected to be available from PRADA and various phone retail stores during the second quarter of this year in France, Germany, Italy, the UK and parts of Asia, the Middle East and South America.

About the AMD Imageon Family
AMD Imageon media processors support a variety of multimedia functions, including mobile TV, video, photography, video telephony, music and 3D graphics processing. To date, more than 200 million AMD Imageon media processors have been shipped to mobile device manufacturers.

With the acquisition of ATI Technologies in 2006, AMD is the leading supplier of media processors to the handheld market, with more than 50 AMD-powered handheld models available in the market from leading manufacturers including BenQ-Siemens, HTC, LG, Motorola and Samsung, among others. For more information, please visit http://ati.amd.com

Manhattan Associates, IBM Take Partnership to New Strategic Level

Manhattan Associates, Inc. (NASDAQ: MANH) today announced a significantly expanded relationship with IBM (NYSE: IBM) to sell and implement supply chain solutions built on IBM’s open technologies for businesses in the retail, consumer goods, manufacturing and transportation industries around the world. As part of this enhanced partnership, the two companies will be ramping up their joint sales efforts across Asia-Pacific, Europe, Latin America and the Middle East, while continuing their efforts in North America.

Working together, Manhattan Associates and IBM will enable companies to gain a global view of their supply chains and improve planning and execution strategies that lead to increased revenue, cost savings and customer satisfaction. This newly expanded relationship is expected to help the two companies capture a larger share of the global supply chain market, estimated by Gartner Group(a) to be $5.4 billion in 2007. Manhattan Associates is one of the world’s leading providers of supply chain solutions, while IBM has the industry's broadest worldwide network of sales, marketing and research and development experts to help close business in global markets.

As part of the agreement, Manhattan Associates will further enhance and develop its global supply chain solutions on IBM hardware, software and services. Manhattan Associates will also deliver its solutions on IBM's WebSphere(a) and Information Management(a) technologies, including WebSphere Application Server, Message Broker, and Transformation Extender, as part of a preferred reference architecture for Manhattan Associates’ Integrated Planning Solutions™ and Integrated Logistics Solutions™.

“Throughout our 15-year history together, IBM and Manhattan Associates have delivered innovative market-leading supply chain solutions. Our joint customers can depend on us to continue to lead the market with solutions that redefine how supply chain leaders drive improvements throughout their global supply chains,” said Pete Sinisgalli, Manhattan Associates’ president and chief executive officer.

Manhattan Associates and IBM share nearly 1,000 customers around the world. By expanding the strategic alliance, the two companies will focus on growing business in core vertical markets such as retail, consumer goods, manufacturing and transportation in all geographies. IBM’s commanding sales presence in these verticals and geographies will contribute significantly to the sale and promotion of Manhattan Associates’ solutions to new customers as well as create additional value for our existing customers. The companies will continue to collaborate on research and development in the IBM Innovation Centers in San Mateo, California and Waltham, Massachusetts.

“Companies of all sizes across the globe are looking for business solutions to improve how they interact with their suppliers, partners and customers,” said Mark Hennessy, general manager, Global Distribution Sector, IBM. “This presents an enormous opportunity for IBM to help its business partners grow their business in both emerging and established markets. With today's announcement, Manhattan Associates is partnering with IBM to capture new potential customers in geographies around the world.”

About Manhattan Associates, Inc.

Manhattan Associates® is a leading supply chain solutions provider. The company’s supply chain planning, supply chain execution, business intelligence and business process platform capabilities enable its more than 1,200 customers worldwide to enhance profitability, performance and competitive advantage. For more information, please visit www.manh.com

IBM and Honeywell Collaborate on Innovative Solutions at Freeport LNG

Today, IBM (NYSE: IBM) announced a collaborative project with Honeywell (NYSE: HON) for the delivery of business process integration and manufacturing execution systems (MES) at the new liquefied natural gas (LNG) terminal being built by Freeport LNG Development, L.P. on Quintana Island near Freeport, Texas. The re-gas terminal will receive LNG shipments from global sources and supply natural gas to various facilities in the Texas Gulf Coast region.

After a 20-year hiatus in LNG terminal development, the Freeport LNG re-gas terminal will be one of the first new terminals in the United States. It will serve industrial and electric power generation natural gas operations between Freeport, Texas and the Houston Ship Channel, and is expected to be commissioned by the fourth quarter of 2007. The first ship is expected to be unloaded by February 2008.

IBM Global Business Services and Honeywell are providing an innovative combination of leading ERP system integration skills (IBM) and MES solutions (Honeywell) to help minimize the systems integration effort and total cost of ownership at the facility. IBM is leading the implementation of the business process integration suite of applications, as well as the integration with Honeywell's advanced MES applications, to provide Freeport LNG with a complete terminal management system.

"In addition to our many intelligent energy solutions, this kind of teaming and collaboration is a key aspect of how IBM is helping energy clients innovate and make the right changes to compete more efficiently and profitably," said Jay Bellissimo, IBM Global Business Services leader for the Americas Chemicals & Petroleum Industry. "Through our relationship with Honeywell, we're addressing new opportunities in LNG around the world. LNG operators are looking for the complete system to meet the demands of the globalization of LNG as a commodity, and the complexities arising from Joint Venture assets. IBM's deep industry experience, background in designing business processes and ERP implementation skills make us uniquely qualified to meet these needs."

There are significant financial, logistical and operating challenges in the global value chain of LNG. LNG operators are seeking turnkey solution providers to improve capital project execution. The integration of IT, ERP, MES and process automation provide reduced cost, schedule, and technical risk on capital projects, as well as an enterprise business framework that boosts LNG value chain visibility.

"We are thrilled to be teaming with IBM and Honeywell on this project. We are keenly aware that the quality of our services directly impacts our Customers' ability to maximize the value of the LNG they process through our plant. Our goal is to become the LNG terminal of choice on the US Gulf Coast by providing the most flexible and highest quality LNG terminal services available. The underlying information systems are critical in reaching that goal," said Hugh Urbantke, Chief Financial Officer, Freeport LNG Development, L.P.

"Honeywell is delighted to collaborate with IBM in providing a truly integrated MES/ERP solution," said Mark Opheim, director of Oil & Gas Marketing at Honeywell. "We now deliver automation, safety, security and advanced applications integrated with ERP systems that deliver improved business performance and peace of mind to our LNG customers around the world."

According to the International Energy Agency, the LNG value chain networks, which took 60 years to develop, will double in size and complexity within the next five years, as the market moves from supply contracts to free market trading. To capitalize on this significant growth, a new study from the IBM Institute for Business Value contends, investors must mobilize quickly and establish flexible business and operational models for an unpredictable and high-stakes future. The study, titled "A High-stakes Race Against Time: Can investors move quickly enough to capture the liquefied natural gas opportunity before it evaporates?" explores the complexity and risk inherent in the LNG marketplace, and provides recommendations for LNG businesses as globalization creates additional uncertainties of supply and demand in what is already a complex commodity market. For more information on this study, visit www.ibm.com/iibv and click on "Chemicals and Petroleum and Executive Briefs."

About Freeport LNG Development, L.P.

Freeport LNG Development, L.P. (FLNG) is a Delaware limited partnership, whose sole general partner is owned 50 percent by Michael S. Smith and 50 percent by ConocoPhillips (NYSE: COP). The limited partners are Michael S. Smith, 45 percent; Cheniere Energy, Inc. (AMEX: LNG), 30 percent; Texas LNG Holdings LLC, a wholly-owned subsidiary of The Dow Chemical Company (NYSE: DOW), 15 percent; and Contango Oil & Gas Company (AMEX: MCF), 10 percent.

More information about the Freeport LNG receiving terminal may be found at www.freeportlng.com

CSCO: Cisco Announces Agreement to Acquire SpansLogic

Cisco Systems, Inc., (NASDAQ: CSCO) today announced a definitive agreement to acquire privately-held SpansLogic Inc., of Mountain View, Calif. SpansLogic is a leading provider of processors that dramatically improve packet processing speeds across the network.

With each generation of Ethernet offering a 10x increase in speed, embedding SpansLogic performance into Cisco's switch platforms will lead to new levels of feature efficiency.

"It is imperative that the network be tightly integrated with very high speed processing capabilities eliminating bottlenecks," said Tom Edsall, Senior Vice President, Datacenter Business Unit (DCBU). "With SpansLogic, Cisco will be able to improve overall traffic efficiency and throughput across the network"

SpansLogic was founded in 2004 and has 14 employees in Mountain View, Calif.

The terms of the deal were not disclosed. The acquisition is subject to various standard closing conditions and is expected to close in the third quarter of Cisco's fiscal year 2007, ending April 28, 2007.

Upon close of the transaction, the SpansLogic team and products will be integrated into DCBU reporting into Edsall.

Sun Microsystems Expands Focus on Silicon Design

Sun Microsystems, Inc. (NASDAQ: SUNW) today announced the formation of a Microelectronics group to be led by executive vice president, Dr. David Yen. The Microelectronics group will oversee the developments in network, cryptography and high-performance computing and serve as a supplier to Sun's existing Systems businesses, in addition to serving OEM customers across the globe. Yen, who previously led Sun's Storage business will be succeeded by Jon Benson, a Sun senior vice president. Both Yen and Benson will report to Jonathan Schwartz, Sun president and CEO.


"The broad acceptance of the open source Solaris operating system running on Dell, HP and IBM hardware shows that Sun's innovations have value and appeal beyond our own servers and storage products," said Schwartz. "With numerous successes including the success of our UltraSPARC T1 processors fueling the growth of our chip multi-threaded servers, the tapeout of our Rock processors defining new terrain in high-productivity computing, and innovations like Project Neptune opening entirely new markets for our technology. Now is the time to fuel that same success with our Microelectronics products. As with our software, decoupling our silicon from a strict reliance on Sun's systems raises our profile and opportunity globally."

For more than 20 years Sun has been a leader in delivering world-class silicon designs, a competency that has proven instrumental in the competitive differentiation of generations of Sun products. Innovations expected from the new Microelectronics group will range from high-speed networking silicon designs to the next generation of open-sourced chip multi-threading processors.

Yen takes the lead of the Microelectronics group with 27 years of technology know-how, engineering vision and business management expertise. His key roles at Sun have included serving as vice president and general manager for Sun's enterprise server business, executive vice president of processor and network products and executive vice president of scalable systems. In the last five years, Yen successfully refreshed the Company's SPARC® processor-based server line, introduced the vision of throughput computing in the processor industry, and released the world's first eco-friendly, multi-core/multi-thread, open-sourced microprocessor, the UltraSPARC T1. Yen has a Ph.D. degree in electrical and computer engineering and holds three U.S. patents.

Benson takes the helm of Sun's Storage business and will lead the evolution of Sun's tape, SAN and archive solutions. As part of the leadership transition, Sun's NAS and storage appliance portfolio—key intersection technologies between Systems and Storage—will move to John Fowler who manages Sun's Systems business unit. By leveraging the expertise and processes used to build servers alongside Solaris, Sun is positioned to build ever more innovative, compelling and competitive products for the storage markets.

Benson, a 20-year veteran of the storage industry, most recently served as vice president of engineering for Sun's virtual storage and tape solutions business. Previously, he was vice president and general manager of StorageTek's overall tape business. In this role, he drove the architecture and development of Sun's award-winning tape automation systems including the Sun StorageTek SL8500 and SL500 tape libraries for which he holds several patents. Benson has a degree in electrical engineering.

"The storage market continues to grow, in diversity and value, and Sun continues to drive innovations at the convergence of the computing, storage and networking markets," adds Schwartz. "Only Sun has the ability to span the mainframe environment, with our legendary SL8500 libraries and crypto-ready T10000 tape drives, all the way through to the emerging market for open source NAS appliances, via the Solaris/ZFS-based Sun Fire x4500. We fully intend on leveraging those assets as we continue to raise our profile and presence in the global market for storage products."

Dell Announces Cloud Computing Solution to Address Unique Needs of Hyper-Scale Data Centers

Dell today announced the availability of the Dell Cloud ComputingTM Solution, the first offering developed by its new business unit – the Dell Data Center Solutions Division.

The move is designed to address a new business opportunity for Dell, the unique needs of businesses operating hyper-scale computing environments that require rack and data center optimized “design–to–order” technology and services.

Dell’s Cloud Computing Solution is designed to provide data center optimization, increased energy efficiency, and lower deployment and overall management overhead for customers whose IT infrastructure, or compute cloud, is the “factory” for their business. These data-intensive customers include major providers of goods and services over the Internet, financial services organizations, national government agencies, institutional university and laboratory environments and upstream petroleum producers.

Dell Cloud Computing combines Dell’s global presence, operational excellence, superior supply chain and engineering capabilities with custom hardware and services based on customers’ unique current and future growth needs.

By taking Dell’s “build-to-order model” to the next step with a “design-to-order” custom hardware and service solution, Dell engineering enables customers to optimize the performance of their IT infrastructure for their specific applications. Those applications use this infrastructure or environment as a virtual computing service, sometimes referred to as “cloud computing.” This customization eliminates the so-called “feature tax” often incurred by customers seeking to leverage general-purpose servers, storage, and networking equipment and services.

"The infrastructure requirements of Web 2.0 companies are distinctive and differ in many ways from the needs of traditional enterprise IT customers," said Matt Eastwood, program vice president for IDC's Enterprise Platforms Group. "Dell recognizes that these customers have unique compute density, power density and manageability needs and the Data Center Solutions Division has been created to offer this growing customer segment access to IT infrastructure solutions tailored for their unique business requirements."

“Businesses requiring hyper-scale computing environments – where infrastructure deployments are measured by up to millions of servers, storage and networking equipment – are changing the way they approach IT to drive revenue growth and decrease operational expenses,” said Brad Anderson, senior vice president, Dell Product Group. “Our unique customer interaction, global reach and speed to market position Dell to offer a total ‘design-to-order’ package, optimized for each customer’s needs. We’re maximizing the performance of their IT infrastructure and providing tangible value to this growing market segment where IT is not just a business factor, it’s a business driver.”

Key features of the customizable Dell Cloud Computing Solution include:

• Capacity Planning for the Data Center – Dell assesses the business needs and requirements of each customer in the context of physical and logical limitations.
• Designed-to-Order Hardware – Prototyping and building hardware solutions that are optimized for specific customer requirements.
• Component Optimization – Dell engineers work at the component level to “right size” and optimize for performance and total cost of ownership, without delivering unnecessary components or features
• Custom Services – Onsite Dell support personnel are available to deploy and service hardware as needed. These fully customizable services are optimized for “hyperscale” data center deployments.

The Dell Cloud Computing Solution is available immediately in the United States. For more information on Dell Data Center Solutions and the Dell Cloud Computing Solution, visit www.dell.com/cloudcomputing.

MSFT: Microsoft and EMC Unveil Systems and Network Management Technology Licensing and Collaboration Agreement

EMC Corp. (NYSE:EMC), the world leader in information infrastructure solutions, and Microsoft Corp. today announced a network management technology licensing agreement and a broader technology collaboration — combining the market’s leading solutions for network and systems management for delivery of network-aware, end-to-end service management. The two companies unveiled the alliance, today at the Microsoft Management Summit (MMS) 2007 in San Diego, Calif.

Key to the announcement, Microsoft is licensing EMC® Smarts® network discovery and health monitoring technology to be included in a future version of Microsoft® System Center Operations Manager, the company’s award-winning solution for end-to-end service monitoring in the enterprise IT environment. Additionally, EMC is also developing value-added network management and root-cause analysis management packs to be used in conjunction with both current and future versions of System Center Operations Manager.

Delivering against the initial phase of this agreement, EMC today is announcing the EMC Smarts Connector for Microsoft System Center Operations Manager 2007. This two-way connector enables Smarts to share network discovery, topology and root-cause events with Operations Manager and for Operations Manager to synchronize alert status and resolution back to EMC Smarts technology — thus allowing customers to leverage the benefits of a closely integrated network and systems management suite for service availability today. The connector will be generally available in May 2007.

“System Center Operations Manager gives customers an integrated, end-to-end service management solution that helps increase efficiency and allows for greater control of the IT environment,” said Bob Muglia, senior vice president of the Server and Tools Business at Microsoft. “By integrating EMC’s market-leading network management technology into Operations Manager and collaborating with EMC to develop a new cross-domain behavioral model that will enhance our management pack schema, we are able to give customers a true network-aware service management solution and improve operations management across disparate devices and systems to help pinpoint the root cause of service-affecting problems.”

Taking the agreement one step further, EMC and Microsoft are collaborating on the
co-development of a cross-domain behavioral model in the context of Operations Manager to improve IT operations management across disparate devices and systems. The companies are committed to driving industry standards which enhance interoperability and simplify management in today’s complex information infrastructures. Leveraging these co-developed models, Operations Manager customers will be able to determine the root cause of service issues across the modeled infrastructure. Additionally, the large ecosystem of Operations Manager partners can add to these models to broaden visibility and control to new devices, services, and applications resulting in lower management costs and reduced complexity.

“The only way to achieve end-to-end service visibility and control across today’s complex information infrastructure is to model and manage the behaviors among components, with a cross-domain model that focuses on elements and how they interact with one another,” said EMC’s Howard Elias, executive vice president, Global Services and Resource Management Software Group. “EMC’s rich history in model-based management and root-cause analysis make it the perfect complement to Microsoft System Center — bringing behavior-aware service integrity to Operations Manager 2007. Together, EMC and Microsoft represent the next wave in model-based management, focused on returning behavioral line of sight to IT operations.”

The EMC and Microsoft collaboration consists of the leading solutions for network and systems management and combines the advanced correlation and root cause capabilities of EMC with the ease-of-use, partner ecosystem, and market reach of Microsoft.

“Today’s enterprises are in need of solutions that offer modular capabilities that combine effective discovery and analytics with domain depth in support of service management across servers, applications, Web services, and the network. The problem is, for the most part, that modular, flexible and deployable solutions that answer critical service management needs are rare in contrast with more rigid platform architectures that require lengthy and painful deployments,” said Dennis Drogseth, vice president, Enterprise Management Associates. “By committing to broad-based technology collaboration, EMC and Microsoft are paving the way for customers to optimize real bench depth in systems, network, and storage and application management capabilities in support of strategic service management.”

About EMC

EMC Corporation (NYSE: EMC) is the world’s leading developer and provider of information infrastructure technology and solutions that enable organizations of all sizes to transform the way they compete and create value from their information. Information about EMC’s products and services can be found at www.EMC.com

Sun Introduces Its First Nebs Level 3 Rack Server Powered By The AMD Opteron Processor, Offering Industry's Broadest OS Support, Including Solaris 10

Sun Microsystems, Inc. (NASDAQ: SUNW) today introduced the Netra X4200 M2 server, Sun's first Network Equipment Building Standard (NEBS) Level 3 Certified Rack Server powered by the AMD Opteron processor and offering the industry's broadest operating system (OS) support, including the Solaris 10 OS, Red Hat and SUSE Linux, and Windows. Based on the Sun Fire X4200 M2 server announced in October 2006, the Netra X4200 M2 server is Sun's first Netra rackmount server developed with industry-standard x64 (x86, 64-bit) architecture.


The Netra X4200 M2 server offers some of the industry's highest storage and memory capacity in a 2U, 20-inch package -- with up to four, 146GB SAS drives and up to 32GB of memory -- and ships ready to support the new Sun Multithreaded Networking Card to enable significantly higher network throughput. Sun will be adding support for the Sun Multithreaded 10 GbE Networking Technology to the Netra family of servers, delivering application performance improvements of up to four times Sun's current network interfaces when paired with x64 or SPARC multi-core servers. The Sun Multithreaded 10 GbE Networking Technology is designed to take advantage of the Solaris OS' threaded design for optimized throughput, regardless of the processor.

"Adding x64 rackmount architecture to the Netra server family extends the choice of platforms for our customers and partners in the telco space," said Mark Butler, Netra systems product line director, Sun Microsystems. "Now telco companies that want industry-standard hardware can develop their solutions on Sun ATCA blades or rackmount servers, the broadest offering of carrier grade platforms in the industry."

"This next deployment of the Sun Netra platform -- the X4200 M2 -- is quite impressive, both from a performance and quality point of view. It not only leverages the throughput and power of AMD64 technology with Direct Connect Architecture but demonstrates Sun’s commitment to our continuing relationship," said Peter Robinson, telecom segment manager, AMD. "Sun and AMD have a long history of providing industry-standard x86 hardware to many vertical markets, and we will continue to work together to extend such offerings to the telco industry."

Customers and ISVs Show Support for Sun Netra Family

The Netra X4200 M2 server can be used to create solutions such as media servers, voice over IP (VoIP), signaling gateway controllers, element management systems, network traffic analysis systems, operation management systems and data management systems. Siemens Networks is deploying Netra X4200 M2 servers to run its VoIP applications.

"Siemens Networks has been validating the Netra X4200 M2 server in our laboratories for several months now," said Joachim Ungruh, Senior Vice President, VoIP Solutions, Siemens Networks. "While we are still in the platform verification phase, it has exceeded our performance expectations. The Netra X4200 M2 will significantly enhance the competitiveness of our Consumer and Business VoIP solution offerings, continuing to reinforce Siemens' strategy to leverage the technology advancements of market-leading computing platforms."

A number of ISVs are developing applications for the Netra X4200 M2 server, including Adax, AppGate Network Security, Appium, jNetX and Surf. In addition, Sun's ATCA products are being used to create solutions for large wireless OAM&P systems, multimedia messaging servers, next-generation IMS platforms, wireless access and next-generation gateways. Sun intends to make its leading Multithreaded 10 GbE Networking Technology available across the ATCA portfolio in the near future. The Netra Data Plane Software Suite announced in December is also gaining support from leading ISVs, including SDC Labs, Surf and Teja Technologies. For more information on ISV support of the Netra X4200 M2, please visit: http://www.sun.com/servers/netra/x4200/perspectives.xml. For more information on ISV endorsements for Sun's ATCA products, please visit: http://www.sun.com/products-n-solutions/boards/cp3060/perspectives.xml

Availability and Pricing

The 2-socket version of the Netra X4200 M2 server is available now, with entry-level pricing starting at $9,845. The 1-socket version is scheduled to be available in May with entry-level pricing starting at $6,145. For more information on the Netra X4200 M2, please visit: http://www.sun.com/netra/x4200. To learn more about Sun's entire Netra ATCA blade server family, please visit: http://www.sun.com/atca. For more information on support for Sun's OEM customers, please visit: http://www.sun.com/oem/

CSCO: Cisco Commences Cash Tender Offer for WebEx at $57.00

Cisco Systems, Inc. (NASDAQ: CSCO), today announced that its wholly-owned subsidiary, Wonder Acquisition Corp., has commenced its tender offer for all outstanding shares of WebEx Communications, Inc. (NASDAQ: WEBX), at a price of $57.00 per share net to the seller in cash without interest, less brokerage fees and less any required withholding taxes. On March 15, 2007, Cisco and WebEx announced that they had signed a definitive merger agreement for Cisco to acquire WebEx.

The Board of Directors of WebEx had previously unanimously approved the merger agreement and the transactions contemplated thereby, including the tender offer; declared that it is in the best interests of WebEx's stockholders for WebEx to enter into the merger agreement and the transactions contemplated thereby; declared that the tender offer is fair to WebEx's stockholders; and recommended that holders of shares of WebEx common stock accept the offer and tender their shares in the offer.

The tender offer is subject to certain conditions set forth in the Offer to Purchase referenced below, including a minimum share tender condition, the expiration or termination of the Hart-Scott-Rodino waiting period, and the obtainment of applicable approvals under the antitrust, competition or merger control laws of other countries, and other customary conditions, as set forth in the merger agreement.

Unless the tender offer is extended, the tender offer and any withdrawal rights to which WebEx's stockholders may be entitled will expire at 12:00 midnight, New York City time, on April 23, 2007 (which is the end of the day on April 23, 2007). Following the acceptance for payment of shares in the tender offer and completion of the transactions contemplated in the merger agreement, WebEx will become a wholly-owned subsidiary of Cisco.

The complete terms and conditions of the tender offer are set forth in the Offer to Purchase, Letter of Transmittal and other related materials filed by Cisco and Wonder Acquisition Corp. with the SEC on March 27, 2007. In addition, on March 27, 2007, WebEx filed a Solicitation/Recommendation Statement on Schedule 14D-9 with the SEC relating to the tender offer. Copies of the Offer to Purchase, Letter of Transmittal and other related materials, including the Solicitation/Recommendation Statement, are available free of charge from Georgeson Inc., the information agent for the tender offer, toll-free at (888) 264-7052 (banks and brokers call (212) 440-9800), or Lehman Brothers Inc., the dealer manager for the tender offer, at (888) 610-5877 (toll free). Computershare Trust Company of New York is acting as depositary for the tender offer.

Konica Minolta and GE Form Strategic Alliance to Accelerate the Commercialization of OLED Lighting

Konica Minolta Holdings, Inc., Konica Minolta Technology Center, Inc. (collectively KM) and the General Electric Company (NYSE:GE) today announced that they have signed a strategic alliance agreement to accelerate the development and commercialization of OLED (Organic Light Emitting Diode) devices for lighting applications. The goal is to bring OLED lighting to market within the next 3 years.

Masatoshi Matsuzaki, President, Konica Minolta Technology Center, Inc., said, “Having such unprecedented attractive features as flexible, thin, light weight, and sheet form, OLED lighting is considered one of the most promising new business opportunities for us in the future. We are delighted to collaborate with GE to accelerate the development and launching of this revolutionary new lighting technology.”

Michael Idelchik, Vice President, Advanced Technology Programs, GE Global Research, said, “The alliance of KM, a world leader in imaging products, and GE, a global leader in lighting products, represents an extraordinary opportunity to make the commercialization of OLED lighting products a reality. Both companies have achieved significant advances in OLED technologies at the research and development stage. Now, we will pool our substantial resources and expertise to accelerate the development of this transformational technology.”

OLEDs are thin, organic materials sandwiched between two electrodes, which illuminate when an electrical charge is applied. They represent the next evolution in lighting products. Their widespread design capabilities will provide an entirely different way for people to light their homes or businesses. Moreover, OLEDs have the potential to deliver dramatically improved levels of efficiency and environmental performance, while achieving at least the same quality of illumination found in traditional products in the marketplace today.

On June 30, 2006, KM announced that it had successfully developed a white OLED with a world record power efficiency of 64 lumens per watt at 1,000 candela per square meter—a brightness which is appropriate for lighting applications. Prior to this development, KM developed its own highly efficient and long-life blue phosphorescent materials. Applying these material technologies, along with multi-layer design technology and innovative optical design technology, KM succeeded in developing an OLED having a practical light emission level of approximately 10,000 hours.

In addition to material technology and optical design technology, KM has been developing the ultra-high barrier film fabrication technology to enable high productivity. Superb coating technology nurtured through the development of photographic film and display materials also plays an important role in the development of highly productive OLEDs. Currently, research and development for its commercialization is under way.

GE, as part of its ecomagination initiative, has made substantial investments in OLED research that have resulted in world records for OLED lighting device size and efficiency. In 2004, GE researchers were able to demonstrate an OLED device that was fully functional as a 24 inch by 24-inch panel, which produced 1,200 lumens of light with an efficiency on par with today’s incandescent bulb technology. This was the first demonstration that OLED technology could potentially be used for lighting applications. Since then, GE has more than doubled the level of OLED efficiency using device architectures that are scalable to a large area and can be produced cost-effectively.

In addition to increasing efficiency, GE has focused on developing all the requirements—ranging from plastic film substrates, ultra-high barrier coatings, and fabrication processes and equipment to enable the high speed, cost-effective “roll-to-roll” manufacturing—required to produce large-area OLED lighting.

GE Consumer & Industrial Vice President Michael Petras said, “In a world demanding higher standards for energy efficiency and environmental performance, OLED lighting has the potential to become a major lighting source on both fronts. And because OLED lighting is soft and diffused, it will create some exciting application opportunities for designers and specifiers. The applications are numerous, ranging from ceiling lighting for office and residential applications to interior automotive and aircraft lighting to many specialty lighting applications such as task lighting, sign and various forms of interior retail lighting.”

In the coming months, KM and GE will further accelerate research and development of OLED lighting by sharing technologies and knowledge. KM’s technology center will lead the research and development activities for KM. GE Global Research, GE’s centralized research and development organization, and GE’s Consumer and Industrial business division will lead research and development for GE.

About Konica Minolta

Konica Minolta Group offers diverse products and services for new digital imaging environments in a wide range of fields. Our business domain is broad, including office equipment, optical devices, medical imaging, graphic imaging and measuring instruments. Its largest office equipment business sector consecutively offers advanced network document solutions, taking advantage of its strengths in high-speed, color and networking technologies.

At Konica Minolta Technology Center, Inc., we are actively developing unique and cutting-edge technologies that will expand the world of imaging, on the basis of proprietary materials, optical, nano-fabrication and imaging technologies. Phosphorescent materials and OLED devices are examples of the notable development activities underway with potential for use in various applications. Konica Minolta’s core technologies are being applied in the development of many other next generation display components and ubiquitous imaging equipment. Visit Konica Minolta at http://konicaminolta.com

About GE Global Research

GE Global Research was the first industrial research lab in the United States and is one of the world's most diversified research centers, providing innovative technology for all of GE's businesses. Global Research has been the cornerstone of GE technology for more than 100 years, developing breakthrough innovations in areas such as medical imaging, energy generation, jet engines, advanced materials and lighting. GE Global Research is headquartered in Niskayuna, New York and has facilities in Bangalore, India; Shanghai, China; and Munich, Germany. Visit GE Global Research at www.ge.com/research

About GE Consumer & Industrial

GE Consumer & Industrial spans the globe as an industry leader in major appliance, lighting and integrated industrial equipment, systems and services. Providing solutions for commercial, industrial and residential use in more than 100 countries, GE Consumer & Industrial uses innovative technologies and "ecomagination," a GE initiative to aggressively bring to market new technologies that help customers and consumers meet pressing environmental challenges, to deliver comfort, convenience and electrical protection and control. General Electric (NYSE: GE) brings imagination to work, selling products under the Monogram®, Profile™ GE®, Hotpoint®, SmartWater™, Reveal®, GE Edison™ and Energy Smart™ consumer brands, and Entellisys™ industrial brand. For more information, consumers may visit www.ge.com

NOTE: For a demonstration of OLED lighting, please visit GE’s technology blog, From Edison’s Desk, at www.grcblog.com

GE Unveils New Advanced Technology Center and Global Services Facility

GE Energy’s (NYSE: GE) nuclear business today opened a new advanced technology center and a global field services facility as the company continues to expand its Wilmington, N.C. site to prepare for new reactor orders and broaden its services capabilities for utility customers.

The advanced technology center will employ hundreds of engineers, project managers and support personnel dedicated to advanced design work and implementation support for the commercial launch of GE’s next-generation technology, the ESBWR. The technology center also will support GE’s ABWR projects around the world.

Andy White, president and CEO of GE Energy’s nuclear business, and U.S. Rep. Mike McIntyre (D – N.C., 7th District), whose district includes Wilmington, participated in the grand opening event.

As utilities prepare to invest in new commercial reactors, White said it is important that GE demonstrate its ability to complete projects on time and on budget for its global customer base.

“Our new advanced technology center will further enhance our ability to coordinate multiple reactor projects, both in the United States and around the world,”

White said. “It’s a key part of our strategy to have the most extensive and advanced engineering, design and production capabilities to meet customer requirements.”

With reactor projects creating thousands of construction and permanent engineering jobs, GE’s advanced technology center also will play an important role in supporting state and local economic development growth for decades to come.

“With the ongoing resurgence in nuclear energy, it is crucial we support the efforts of GE to be in the best position possible to prepare for new reactor orders, which will yield significant economic benefits for our communities,” Rep. McIntyre said.

Utilizing natural circulation and passive safety systems, the ESBWR is more efficient to operate, features a smaller building footprint and is less expensive to build, with a projected 36-month construction schedule from the pouring of concrete to first-fuel load.

GE’s Field Services Operation Essential to Customers’ Success

In addition to the advanced technology center, GE unveiled a new global services center dedicated to supporting GE’s services business and its customers around the world.

“By providing the best possible service to existing nuclear power plants, GE’s commitment to excellence is reinforced with our customers, many of which are now preparing to invest in new reactor projects,” White said.

By optimizing service capabilities during outages, GE will continue to help customers reduce the amount of time that a reactor needs to be offline for maintenance while extending the operating period of the reactor between outages, thus potentially saving the operator millions of dollars.

For example, two GE-designed boiling water reactor (BWR) units at Exelon Nuclear’s LaSalle County Generating Station in Illinois recently set new world records for the longest continuous operation of light water reactors. The LaSalle plant produces enough electricity for 2.3 million homes.

GE Invests in Preparation for New Reactor Orders

Since 2003, GE has hired 500 new engineers and other personnel in preparation for new unit orders. GE also has executed a strategic consolidation in Wilmington of several existing GE nuclear facilities located around the United States.

GE’s ESBWR and ABWR technology has already been selected for five potential projects for new commercial reactors in the United States. The ESBWR is being considered for deployment by several U.S. utilities and in a number of other countries. Meanwhile, the U.S. Nuclear Regulatory Commission is currently performing its design certification review of the ESBWR. GE recently submitted its third revision of the Design Certification Document on schedule to the NRC for review.

The ABWR is the world’s first commercially proven, Generation III reactor design and has been licensed for construction in the United States, Japan and Taiwan.

GE’s nuclear business has been a leading provider of light water reactor technology and services for more than 50 years, helping owners of both boiling and pressurized water reactors safely operate their facilities with greater efficiency and output.

About GE Energy

GE Energy (www.ge.com/energy ) is one of the world’s leading suppliers of power generation and energy delivery technologies, with 2006 revenue of $19 billion. Based in Atlanta, Georgia, GE Energy works in all areas of the energy industry including coal, oil, natural gas and nuclear energy; renewable resources such as water, wind, solar and biogas; and other alternative fuels.

Numerous GE Energy products are certified under ecomagination, GE’s corporate-wide initiative to aggressively bring to market new technologies that will help customers meet pressing environmental challenges.

ORCL: Oracle Announces Oracle-Sun Information Appliance Foundations

Oracle today announced the Oracle-Sun Information Appliance Foundations that allow joint Oracle and Sun customers to reduce the risk and deployment time of data warehousing solutions based on Oracle(r) Database 10g and Sun servers, storage and the Solaris 10 Operating System (OS).
The Oracle-Sun Information Appliance Foundations are reference configurations that provide a recommended database, server, and storage mix for a customer's specific requirements. Implementing an Oracle-Sun Information Appliance Foundation-based data warehouse solution can decrease customers' buying cycle by weeks and streamline data warehouse implementations.

As part of Oracle's Information Appliance Initiative, these reference configurations have carefully combined CPU resources, memory, I/O bandwidth and disks into a well-balanced design that will help prevent performance or capacity bottlenecks. Oracle and its hardware partners have developed configurations for data warehouses with varying raw data, average concurrent user and workload complexity. These configurations have the capability to handle data warehouses ranging from 300 gigabytes to 10 terabytes, and from light to heavy workloads. The Oracle-Sun Information Appliance Foundations offer multiple solutions for each set of requirements allowing customers to quickly choose among vertical (single server systems), horizontal (clustered server systems) configurations and SPARC(tm) or x64 (x86, 64-bit) architectures running Solaris(tm) or other supported operating systems. In addition to the servers, the Foundations also cover Sun's StorageTek disk arrays.

"These Foundations provide our customers a choice of fast, scalable and reliable solutions to run their data warehousing systems," said Willie Hardie, vice president of Database Product Marketing, Oracle. "They're designed to help take the risk out of building a data warehouse that can meet short term requirements and provide a path for future growth. This announcement marks another significant milestone in delivering business value for Sun and Oracle customers."

"Sun and Oracle's joint effort improves architecture design and selection processes for IT departments, making it easy to implement well-designed, right-sized data warehouse solutions built upon Sun's robust infrastructure offerings including the Solaris 10 operating system," said Juan Carlos Soto, vice president of market development at Sun. "Customers are sure to benefit from this timely and economic approach, making these joint reference configurations the smart way to pick the optimal solution for their business."

For more information about the Oracle and Sun Reference Configuration program customers can go to: http://www.oracle.com/solutions/business_intelligence/sun.html. For more information about the Oracle Information Appliance Initiative, go to: http://www.oracle.com/solutions/business_intelligence/oiai.html .

About Oracle Database 10g
The only database designed for grid computing, Oracle Database 10g delivers superior performance, scalability, availability, security and ease of management on a low-cost grid of industry standard storage and servers. Oracle Database 10g is designed to be effectively deployed on everything from small blade servers to the biggest SMP servers and clusters of all sizes. It features automated management capabilities for easy, cost-effective operation. Oracle Database 10g's unique ability to manage data from traditional business information to XML documents and spatial/location information makes it the ideal choice to power online transaction processing, decision support and content management applications.

About Oracle
Oracle (NASDAQ GS: ORCL) is the world's largest enterprise software company. For more information about Oracle, please visit our Web site at http://www.oracle.com .

SY: Spanish Postal Service Deploys Sybase iAnywhere RFID Technology

Sybase iAnywhere today announced that Correos, the Spanish Postal Service, has deployed its RFID Anywhere™ software platform in one of the largest RFID projects in Europe. Using RFID Anywhere, Correos has introduced a radio frequency control system, called Q-RFID, in 16 Automated Processing Centers (APCs) throughout Spain, and in four other bulk Admission Centers, enabling the company to ensure quality control and the traceability of postal deliveries.


“The use of RFID Anywhere enhances Correos' competitiveness as a result of more efficient management of postal processes and an improvement in the quality of its services,” said Regina Defarges, organizational deputy director, Correos. “We’re proud to be the forerunner in the use of RFID technology in the postal industry.”


Correos’ successful implementation of one of the largest RFID projects in Europe highlights the potential of RFID solutions. The state-controlled company required its RFID solution to be integrated into the Correos computer systems, resulting in the purchase of 13,000 passive electronic labels and installation of more than 2,300 permanent antennas and over 331 readers for the 16 APCs and the additional Admission Centers. The RFID Anywhere-powered solution gives Correos the ability to monitor the status and transit time of a letter at each stage of the delivery process, allowing the company to oversee the entire process and adopt corrective measures when a fault is detected in the system. Correos is one of the earliest to use RFID technology to comply with the standards set by the European Union (ETSI EN 302 208-1 and EPC GEN 2) and to be approved at the state level by the Ministry of Industry, Tourism and Trade.

”The postal industry provides an excellent example of how RFID technology can increase process efficiencies resulting in improved delivery times and streamlining of operating procedures,” said Martyn Mallick, director of RFID Technologies, Sybase iAnywhere. “Correos chose RFID Anywhere for its superior ability to coordinate a vast number of RFID readers in a dense environment and to integrate business logic and processes with the latest automatic data collection and sensor technologies.”

To learn more about RFID Anywhere, please visit the Sybase iAnywhere RFID World 2007 booth #1425. Additionally, director of RFID Technologies, Martyn Mallick, will be speaking on “Tracking Mixed-Value Assets: The Business Case and Technology Requirements,” on Tuesday, March 27 at 3:30 PM. To join the very popular RFID Anywhere developer community and to download a free development copy of RFID Anywhere, visit www.sybase.com/products/mobilesolutions/rfid_anywhere

SY: Sybase iAnywhere Drives RFID Innovation in Vehicle-Mounted Terminals

Sybase iAnywhere today announced new enhancements to RFID Anywhere™, the company’s software infrastructure that provides a customizable environment for developing and managing robust, highly-distributed radio frequency identification (RFID) solutions. With RFID Anywhere 3.1, Sybase iAnywhere continues to break new ground with advanced on-device capabilities for vehicle-mounted terminals, allowing these devices to work autonomously, dramatically reducing the amount of data that needs to be communicated back to enterprise servers. RFID Anywhere 3.1 has been certified to work with and will support LXE’s RX2 forklift RFID devices.

“Sybase iAnywhere truly understands the requirements for mobile and vehicle-mounted based RFID applications,” said Dick Sorenson, RFID director, LXE. “RFID Anywhere 3.1 combines technologies such as RFID, voice, mobile, location-awareness, business intelligence and barcode scanning, making it the perfect fit for LXE rugged mobile RFID readers, enabling customers to rapidly develop, deploy and manage mobile RFID warehouse applications.”

LXE provides rugged wireless computers and data collection solutions that improve supply chain performance. LXE’s RX2 rugged lift truck-mounted RFID reader is an easy-to-install, vehicle-mounted RFID reader designed for RFID-enabled forklift pallet movement applications such as shipping, receiving, picking and put-aways. LXE’s ARIA (Adaptive Recognition and Information Assurance) solutions combine the strengths of multiple technologies, such as RFID, voice recognition, sensors and wearable computing, with next generation software applications and new business processes so that warehouse operators can execute warehouse transactions more naturally, efficiently and effectively. ARIA-enabled solutions built on the RFID Anywhere technology infrastructure will achieve new levels of efficiency, velocity, visibility and accuracy in supply chain execution.

“As we continue to work with customers and partners such as LXE, there is a growing demand to support multiple sensor technologies, including voice interactions,” said Martyn Mallick, director of RFID technologies, Sybase iAnywhere. “With RFID Anywhere 3.1 we continue to lead the market by providing an intelligent client that allows these devices to filter, smooth and report on data in real-time without human interaction. This is a vast improvement over current mobile and vehicle-mounted implementations.”

RFID Anywhere 3.1 offers key enhancements in a number of areas:

• Enhanced support for vehicle-mounted devices, including the LXE RX2 forklift RFID device, providing enhanced on-device functionality, including smoothing implementation, unattended client, automatic start, the ability to work both online and offline, and extended mobile device events


• Updated connectors for Active RFID and RTLS devices to support the INCITS T20 standard


• New support for the Point Six temperature sensor


• Enhancing support for passive RFID with updates to existing hardware connectors and new hardware connectors for Siemens SIMATIC® RF


• Administrator console improvements including the ability to deploy device firmware updates

Availability
Sybase iAnywhere plans to make RFID Anywhere 3.1 available in April 2007. To learn more, please visit the Sybase iAnywhere RFID World 2007 booth #1425. To see a live demo of this technology in action, visit LXE at RFID World 2007 booth #910. Additionally, director of RFID technologies, Martyn Mallick, will be speaking on “Tracking Mixed-Value Assets: The Business Case and Technology Requirements,” on Tuesday, March 27 at 3:30 PM. To join the very popular RFID Anywhere developer community and to download a free development copy of RFID Anywhere, visit www.sybase.com/products/mobilesolutions/rfid_anywhere

About RFID Anywhere
RFID Anywhere simplifies the development, deployment, configuration and management tasks for highly distributed, multi-site, intelligent sensor networks, and abstracts the interaction with the physical network of devices. With support for over forty devices, this powerful infrastructure enables the creation of intelligent sensor networks out-of-the-box. By using RFID Anywhere, sensors are able to work together as an intelligent network by combining, organizing and coordinating these technologies through a common management structure, advanced feature set and event-driven development framework.

About Sybase iAnywhere
Sybase iAnywhere enables success at the front lines of business. The company holds worldwide market leadership positions in mobile and embedded databases, mobile management and security, mobile middleware and synchronization, and Bluetooth® and infrared protocol technologies. Tens of millions of mobile devices and over 20,000 customers and partners rely on the company’s “Always Available” technologies, including SQL Anywhere, Afaria and OneBridge. iAnywhere is a subsidiary of Sybase, Inc. (NYSE:SY).

CSCO: AMD Enhances Business Performance with Cisco Intelligent Networked Manufacturing Solutions

Advanced Micro Devices Export Sdn. Bhd., the manufacturing facility of Advanced Micro Devices (NYSE: AMD), has adopted Cisco® Intelligent Networked Manufacturing Solutions to enhance efficiency and reduce lead times in its manufacturing cycle.

Based on a single open, intelligent, standards-based Ethernet platform, the Cisco Intelligent Networked Manufacturing infrastructure helps AMD link together collaborative applications that integrate information and processes spanning the entire manufacturing workflow. These solutions increase visibility and flexibility across the four major parts of a manufacturing organization: product development, supply chain management, production management, and sales and service management.

AMD is a leading global provider of innovative microprocessor solutions for computing, communications and consumer electronics markets. The company has a manufacturing facility in Penang, Malaysia, which assembles AMD microprocessors and employs more than 800 employees.

At the heart of AMD's infrastructure is the Cisco Ethernet to the Factory (EttF) solution, which bridges the gap between the corporate office and the production floor, allowing AMD to make strategic business decisions that are backed by real-time data from the plant floor. As an end-to-end solution, Cisco EttF allows highly secure, real-time visibility between the production floor and enterprise resource planning (ERP) and supply-chain management (SCM) systems. It delivers the flexibility that allows customers to change orders or specifications without compromising the security and performance of existing production processes.

In addition to EttF, AMD also deployed a Cisco Unified Communications solution that has improved mobility collaboration throughout the company's operations, particularly in the clean room. A clean room is one of the most important requirements of precision parts assembly. The solution, which includes Cisco Unified IP Phones and a wireless Cisco Aironet® wireless network, enables AMD staff to communicate in the clean room using the Cisco Unified Wireless IP Phone 7920. It is the only certified wireless phone allowed in that environment due to its low radiation emissions.*

In addition, with their increased mobility, most employees can now access information from wherever they are, saving significant time. Additional benefits include the increased efficiency of a single network that supports voice and data, which has in turn reduced the total cost of ownership as well as administrative costs.

"AMD is a model for how the manufacturing industry can make the most of networking technologies. The Intelligent Networked Manufacturing strategy enables manufacturing companies to take business efficiency to new levels even in physically challenging environments. By working closely with AMD, Cisco, together with the systems integrator, HP, was able to propose solutions that met its rigorous requirements," said Kumaram Singaram, Cisco's managing director for Malaysia.

* The radio module in the Cisco Unified Wireless IP Phone 7920 is compliant with the requirements addressing RF exposure from radio frequency devices. These guidelines were developed by the industry based on guidance from the World Health Organization (WHO). The phone operates at power levels one-fifth to one-sixth of those in most standard cellular, Personal Communications Service (PCS), or Global System for Mobile Communications (GSM) phones.

INTC: Intel To Build 300mm Wafer Fabrication Facility In China

Intel Corporation today announced plans to build a 300-millimeter (mm) wafer fabrication facility (fab) in the coastal Northeast China city of Dalian in Liaoning Province. The $2.5 billion investment for the factory designated Fab 68 will become Intel's first wafer fab in Asia and adds significant investment to Intel's existing operations in China.

"China is our fastest-growing major market and we believe it's critical that we invest in markets that will provide for future growth to better serve our customers," said Intel President and CEO Paul Otellini. "Fab 68 will be our first new wafer fab at a new site in 15 years. Intel has been involved in China for more than 22 years and over that time we’ve invested in excess of $1.3 billion in assembly test facilities and research and development. This new investment will bring our total to just under $4 billion, making Intel one of the largest foreign investors in China."

Not since 1992 with the construction of Fab 10 in Ireland has Intel built a fab from the ground up at a brand new site. Construction on Fab 68 is scheduled to begin later this year with production projected to begin in the first half of 2010. Initial production will be dedicated to chipsets to support Intel's core microprocessor business.

"This is one of the major cooperative projects between China and the United States in the area of integrated circuits manufacturing in recent years. The project will further strengthen Intel's leadership position in the semiconductor manufacturing in the world. At the same time, the investment in Dalian will have a positive impact to the regional economic development and the development of integrated circuits industry in the old industrial base of northeast China," said Zhang Xiaoqiang, vice chairman of the National Development and Reform Commission. "We welcome Intel and other multinational companies to invest and cooperate with China. We support Intel's initiative to expand and strengthen cooperation with relevant parties in a number of areas, such as talent training, technology standards, improved information technology for rural areas and digital health, to promote the mutual benefit and win-win of Intel and the information industry of China, and to achieve the goal of growing together."

Dalian Mayor Xia Deren said, "As an open city on China's coastline, Dalian provides many geographic advantages as well as existing infrastructure and services for foreign investment. We are very excited Intel has chosen Dalian to build a wafer fabrication facility. This investment will not just impact Dalian's social and economic development, but will generate a significant and positive impact on the economic and industrial structure in Northeast China."

When completed, Fab 68 will become part of Intel's manufacturing network that includes eight 300mm factories in 2010 with other fabs located in the United States, Ireland and Israel. Manufacturing with 300mm wafers dramatically increases the ability to produce semiconductors at a lower cost compared with more commonly used 200mm (eight-inch) wafers. The bigger wafers lower production cost per chip while diminishing overall use of resources. Using 300mm manufacturing technology consumes 40 percent less energy and water per chip than a 200mm wafer factory.

IBM Researchers Demonstrate World's Fastest Optical Chipset

At the 2007 Optical Fiber Conference, IBM (NYSE: IBM) scientists will reveal a prototype optical transceiver chipset capable of reaching speeds at least eight times faster than optical components available today.

The breakthrough could transform how data is accessed, shared and used across the Web for corporate and consumer networks. The transceiver is fast enough to reduce the download time for a typical high definition feature-length film to a single second compared to 30 minutes or more.

The ability to move information at blazing speeds of 160 Gigabits -- or 160 billion bits of information in a single second -- provides a glimpse of a new era of high-speed connectivity that will transform communications, computing and entertainment. Optical networking offers the potential to dramatically improve data transfer rates by speeding the flow of data using light pulses, instead of sending electrons over wires.

"The explosion in the amount of data being transferred, when downloading movies, TV shows, music or photos, is creating demand for greater bandwidth and higher speeds in connectivity," said Dr. T.C. Chen, vice president, Science & Technology, IBM Research. "Greater use of optical communications is needed to address this issue. We believe our optical transceiver technology may provide the answer."

As the amount of data transmitted over networks continues to grow, researchers have been looking for ways to make the use of optical signals more practical. The ability to use these signals could offer previously unheard of amounts of bandwidth and enhanced signal fidelity compared to current electrical data links. By shrinking and integrating the components into one package, and building them with standard low-cost, high-volume chip manufacturing techniques, IBM is making optical connectivity viable for widespread use.

For example, the technology could be integrated onto printed circuit boards to allow the components within an electronic system – such as a PC or set top box -- to communicate much faster, dramatically enhancing the performance of the system itself.

To achieve this new level of integration in the chipset, IBM researchers built an optical transceiver with driver and receiver integrated circuits in current CMOS technology, the same standard, high-volume, low-cost technology used for most chips today. They then coupled it with other necessary optical components made in more exotic materials, such as indium phosphide (InP) and gallium arsenide (GaAs), into one, integrated package only 3.25 by 5.25 millimeters in size.

This compact design provides both a high number of communications channels as well as very high speeds per channel, resulting in an amount of information transmitted per unit area of card space taken up by the chipset (the ultimate measure of viability for practical use) that is the highest ever. This transceiver chipset is designed to enable low cost optics by attaching to an optical printed circuit board employing densely spaced polymer waveguide channels using mass assembly processes.

The report on this work, “160-Gb/s, 16-Channel Full-Duplex, Single-Chip CMOS Optical Transceiver,” by C.L. Schow, F.E. Doany, O. Liboiron-Ladouceur, C. Baks, D.M. Kuchta, L. Schares, R. John, and J.A. Kash of IBM’s T. J. Watson Research Center, Yorktown Heights, N.Y. will be presented on March 29 at the 2007 Optical Fiber Conference in Anaheim. This work was partially funded by Defense Advanced Research Project Agency through the Chip to Chip Optical Interconnect (C2OI) program.

About the IBM Research Division
IBM Research is the world's largest information technology research organization, with about 3,000 scientists and engineers in eight labs in six countries. IBM has produced more research breakthroughs than any other company in the IT industry.