Intel Unveils 16 Next-Generation Processors, Including First Notebook Chips Built on 45nm Technology

Intel Corporation unveiled 16 products today, including the company's first 45 nanometer (nm) processors for Intel® Centrino® Processor Technology based laptops.

All of these new chips include the company's new transistor formula and 45nm manufacturing process that boost a PC's speed, reduces power requirements, saves on battery life, helps the environment and comes in smaller packages for more fashionable and compact computer designs. With the introduction of the new processors, Intel will be offering a total of 32 desktop, laptop and server processors based on these industry-leading innovations.

The company also highlighted how it will take advantage of its transistor and manufacturing advances to spur a category of small form-factor, low-powered, high-performance devices that deliver broadband Internet access "in your pocket." The processors are up to 25 percent smaller than previous versions so computer makers can create sleek, new designs for consumers ranging from stylish all-in-one desktop PCs to smaller notebooks.

Among the 16 new products, 12 are designed for new laptops and desktops products and four are for servers. All are now lead-free1 and, starting this year, halogen-free2, making the processors more eco-friendly.

"The new products we're announcing today provide consumers and businesses with the benefit of sleeker and higher-performing laptops and more powerful and fashionable PCs that deliver for the most hard-core gamer, high-definition enthusiast and just about every other consumer demand," said Mooly Eden, vice president and general manager, mobile platforms group, Intel. "And later this year, Intel will begin delivering the mobile Internet with much smaller, lighter and powerful Internet-enabled devices that ultimately will fit right into your pocket."

Intel Adds Mobile Processors to Line-up
Intel is shipping five new mobile processors, enabling breakthrough performance and improved battery life, providing consumers with the ability to be more productive or just enjoy their digital entertainment while on the go. Helping to extend battery life is also a new Intel Core microarchitecture design feature for advanced power management state called Deep Power Down Technology that reduces the power of the processor when it's not running data or instructions to the laptop.

The processors are the foundation for the company's popular Intel® Centrino® technology for laptops, and deliver improved content and video capabilities with HD DVD* and Blu-Ray* support with an optional third-party decoder. Centrino-based notebooks also come with the Mobile Intel® 965 Express Chipset and wireless networking including the optional support for 802.11n networks with Intel® Next-Gen Wireless-N.

Intel has also added new video and graphics capabilities with Intel® HD Boost that includes Intel® Streaming SIMD Extensions 4 (SSE4) for speeding up workloads including video encoding for high-definition and photo manipulation.

Intel will also use this mobile technology foundation and energy-efficient performance to enable a variety of smaller, cooler and quieter, stylish desktop designs. These computers, including the increasingly popular "all-in-one" category, provide the performance to run a variety of digital media and the latest software simultaneously, as well as enhanced high-definition video and smoother playback using Intel® Clear Video Technology.

More Mobility on Tap: in Your Pocket; Wireless WiMAX
Pushing the power of the full Internet "in your pocket," Intel's strategy for using low-power Intel Architecture platforms that drastically reduce CPU and chipset power, and package size continues to gain momentum. Intel plans to ship in the first half of this year its first-generation low-power platform chipset that will help deliver a range of ultra mobile and mobile Internet devices from a growing ecosystem of customers.

Intel also continues to work closely with carriers around the world to deploy mobile WiMAX networks. These networks will help deliver true high-speed mobile Internet experiences to a variety of digital devices starting later this year.

Mainstream Desktop PCs Get 45nm Performance and Efficiency Boost
Building on its November 2007 introduction (the Intel® Core™2 Extreme quad-core processor QX9650), Intel announced three quad core and four dual core 45nm-based processors for mainstream desktop PCs arriving later this month and throughout the first quarter of the year.

The new Intel® Core™ 2 Quad and Intel Core™ 2 Duo processor offerings will speed the transition to Intel's newest processor line and multicore adoption, and are arriving at a time when digital and high-definition content, including photos, home videos, music, television shows and social networking, continues to grow exponentially.

Consumers will realize more performance at a variety of PC purchase prices as these processors feature a range of clock speeds, large L2 caches, and also come equipped with Intel® HD Boost (SSE4 instructions). These 45nm processors are also a requirement for computer-makers carrying the Intel Core™2 Processor with Viiv™ technology brand, making it easier for consumers to select a great entertainment PC with Intel's most innovative technologies.

Dual core desktop processor-based PCs using these new processors begin shipping this month; quad core-based systems plan to arrive later this quarter.

The company also introduced four Intel Xeon processors for servers and workstations; they are expected to ship this quarter.

About Intel
Intel, the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and blogs.intel.com .

Intel, Centrino, Xeon, and Core are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 45nm product is manufactured on a lead-free process. Lead-free per EU RoHS directive July 2006. Some E.U. RoHS exemptions may apply to other components used in the product package.

2 Residual amounts of halogens are below November 2007 proposed IPC/JEDEC J-STD-709 standards.

Intel and Google Join with Dell,EDS,EPA,HP,IBM,Lenovo, Microsoft, PG&E, World Wildlife Fund and Others to Launch Climate Savers Computing Initiative

Intel Corporation and Google* joined with Dell*, EDS*, the Environmental Protection Agency*, HP*, IBM*, Lenovo*, Microsoft*, Pacific Gas and Electric*, World Wildlife Fund*, and more than a dozen additional organizations today announcing their intent to form the Climate Savers Computing Initiative (www.climatesaverscomputing.org ). The goal of the new broad-based environmental effort is to save energy and reduce greenhouse gas emissions by setting aggressive new targets for energy-efficient computers and components, and promoting the adoption of energy-efficient computers and power management tools worldwide.

"Today, the average desktop PC wastes nearly half of its power, and the average server wastes one-third of its power," said Urs Holzle, senior vice president, Operations, Google Inc. "The Climate Savers Computing Initiative is setting a new 90 percent efficiency target for power supplies, which if achieved, will reduce greenhouse gas emissions by 54 million tons per year -- and save more than $5.5 billion in energy costs.

"We are asking businesses and individuals throughout the world to join with us to institute better power management of their computing equipment and purchase energy-efficient computers," Holzle added.

Initial companies who intend to participate in the initiative represent both the demand and supply side of the computer industry, including computer manufacturers and chip makers, as well as environmental groups, energy companies, retailers, government agencies and more. The group will formalize its membership in coming weeks.

"By 2010, the Climate Savers Computing Initiative will cut greenhouse gas emissions in an amount equal to removing more than 11 million cars from the road or shutting down 20 500-megawatt coal-fired power plants -- a significant step in reducing the emissions affecting our planet," said Pat Gelsinger, senior vice president and general manager of Intel's Digital Enterprise Group.

"Computers have helped us make huge strides toward a more efficient world today, with reduced travel, more productivity, online transactions and more," Gelsinger added. "But with today's latest energy-efficient technologies, we can do even more. The commitment of the member companies that are here with us today is a firm statement to the collective resolve to make an enormous impact."

Computer and computer component manufacturers who support the initiative are committed to building energy-efficient products that meet or surpass the EPA's Energy Star* guidelines. Businesses must also commit to requiring high efficiency systems for the majority of their corporate desktop PCs and volume server purchases, and to deploy and use power management tools on desktop PCs.

Individual consumers can also support the Climate Savers Computing Initiative by signing up at www.climatesaverscomputing.org, where they will be able to pledge to purchase an initiative-certified system. The Web site will also help consumers learn how to take advantage of their existing computer's power-saving capabilities such as sleep and hibernate modes, which can reduce the amount of energy consumed by up to 60 percent.

The Climate Savers Computing Initiative licensed its name from the World Wildlife Fund Climate Savers program, which involves several leading companies working to reduce their carbon footprint.

"This is the first time our Climate Savers program has been applied to an entire sector, engaging manufacturers, retailers, and consumers," said John Donoghue, senior vice president for the WWF. "We are pleased to join these industry leaders to provide solutions to address climate change."

The initiative's energy efficiency benchmarks will initially follow the EPA's Energy Star guidelines; but with increasing requirements during the next several years. For example, 2007 Energy Star specifications require that PC power supplies meet at least 80 percent minimum efficiency. The initiative would require a minimum of 90 percent by 2010. In addition, the initiative sets a higher efficiency target in the power supply for volume servers (1U and 2U single-socket and dual-socket systems): an increase from 85 percent to 92 percent efficiency by 2010. For a complete description of the requirements, see www.climatesaverscomputing.org.

Initial Supporters
Intel Corporation (www.intel.com),
Google, Inc.* (www.google.com),
Advanced Micro Devices, Inc.* (www.amd.com),
Canonical Ltd.* (www.canonical.com),
Center for Information Technology Research in the Interest of Society* (www.citris-uc.org), Coldwatt, Inc.* (www.coldwatt.com),
Dell Inc.* (www.dell.com),
Delta Electronics, Inc.* (www.delta.com.tw),
eBay* (www.ebay.com)
Electronic Data Systems Corporation* (www.eds.com),
EMC Corporation* (www.emc.com),
Fujitsu Limited* (www.fujitsu.com),
Hewlett-Packard Development Company, L.P.* (www.hp.com),
Hipro Technology Inc.* (www.hipro-us.com),
Hitachi, Ltd.* (www.hitachi.com),
IBM Corporation* (www.ibm.com),
LANDesk Software* (www.landesk.com),
Lenovo Group Limited* (www.lenovo.com),
Linux Foundation* (www.linux-foundation.com),
Massachusetts Institute of Technology* (web.mit.edu),
Microsoft Corporation* (www.microsoft.com),
Natural Resource Defense Council* (www.nrdc.org),
NEC Corporation* (www.nec.com),
One Laptop per Child* (www.laptop.org),
PG&E Corporation* (www.pgecorp.com),
Power-One, Inc.* (www.power-one.com),
Quanta Computer Inc.* (www.quantatw.com),
Rackable Systems* (www.rackable.com),
Red Hat, Inc.* (www.redhat.com),
Starbucks Corporation* (www.starbucks.com),
Sun Microsystems, Inc.* (www.sun.com),
Supermicro Computer Inc.* (www.supermicro.com),
United States Environmental Protection Agency* (www.epa.gov),
University of Michigan* (www.umich.edu),
Unisys (www.unisys.com)
Verdiem Corporation* (www.verdiem.com),
World Wildlife Fund* (www.worldwildlife.org),
World Resources Institute* (www.wri.org),
Yahoo!* (www.yahoo.com).


About Intel
Intel, the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom.

About Google Inc.
Google's innovative search technologies connect millions of people around the world with information every day. Founded in 1998 by Stanford Ph.D. students Larry Page and Sergey Brin, Google today is a top web property in all major global markets. Google's targeted advertising program provides businesses of all sizes with measurable results, while enhancing the overall web experience for users. Google is headquartered in Silicon Valley with offices throughout the Americas, Europe and Asia. For more information, visit www.google.com.


* Other brands may be claimed as the property of others.
†Based on IDC projections of desktop and server volumes between 2007 and 2011. Emissions savings in mid-2010, and savings are annual starting in 2010.

Intel Eliminates Use Of Lead From Future Microprocessors

Intel Corporation today announced that its future processors, beginning with its entire family of 45 nanometer (nm) high-k metal gate (Hi-k) processors, are going 100 percent lead-free. The Intel 45nm Hi-k family includes the next-generation Intel® Core™ 2 Duo, Core 2 Quad and Xeon® processors, and the company will begin 45nm Hi-k production in the second half of this year.

"Intel is taking an aggressive stance toward environmental sustainability, from the elimination of lead and a focus on greater energy efficiency of our products to fewer air emissions and more water and materials recycling," said Nasser Grayeli, Intel vice president and director of assembly test technology development, Technology and Manufacturing Group.

Lead is used in a variety of micro-electronic "packages" and the "bumps" that attach an Intel chip to the packages. Packages wrap around the chip and ultimately connect it to the motherboard. Different types of packages are used for processors targeted at specific market segments, including mobile, desktop and server. Package designs include pin grid array, ball grid array and land grid array, and all are 100 percent lead-free in Intel's 45nm Hi-k technology generation. In 2008, the company will also transition its 65nm chipset products to 100 percent lead-free technology.

Intel's 45nm processors not only are lead-free, they also make use of the company's Hi-k silicon technology for reduced transistor leakage, enabling more energy-efficient, high-performance processors. The company's 45nm Hi-k silicon technology also includes third-generation strained silicon for improved drive current and a lower interconnect capacitance using low-k dielectrics for increased performance and lower power. Ultimately, Intel's 45nm Hi-k family of processors will enable sleeker, smaller and more energy-efficient desktop, notebook PC, mobile internet device and server designs.

The Road to Lead-Free
For many decades lead has been used in electronics because of its electrical and mechanical properties, making the search for replacement materials that meet performance and reliability requirements a significant scientific and technical challenge.

Due to lead's potential impact to the environment and public health, Intel has worked for years with its suppliers and other companies in the semiconductor and electronics industry to develop lead-free solutions as part of its long-standing commitment to environmental practices. In 2002, Intel produced its first lead-free flash memory products. In 2004, the company began shipping products with 95 percent less lead than previous microprocessor and chipset packages.

To replace the remaining 5 percent (about .02 grams) of lead solder historically found in the first-level interconnect -- the solder joint that connects the silicon die to the package substrate -- in processor packages, Intel will use a tin/silver/copper alloy. It is the way in which Intel will implement these new materials to replace the tin/lead solder that is the "secret sauce" of the company's solution. Because of the complex interconnect structure of Intel's advanced silicon technologies, a great deal of engineering work was required to remove the remaining lead in Intel's processor packages and integrate a new solder alloy system.

Intel engineers developed the assembly manufacturing processes involving the new solder alloys, and were able to accomplish this while still demonstrating the high level of performance, quality and reliability expected of Intel components.

Environmental Sustainability -- From Transistors to Factories
Intel has a long history of commitment to the environment, a philosophy that began with its founder Gordon Moore. In addition to eliminating the use of lead in its products, Intel has developed a number of environmental best-practices in its factories and operations. It is also designing and building energy efficiency into everything it does, from the smallest 45nm transistors in its forthcoming lead-free processors and today's high-performance Intel Core 2 Duo processors that consume up to 40 percent less energy to broad support for industry standards and strong public policies. Among many examples:

• Earlier this year Intel transitioned its Intel® StrataFlash® Cellular Memory packages to halogen-free technology. The company is currently evaluating the use of halogen-free flame retardants in its CPU package technologies.


• In 1996, Intel led an industry-wide agreement to reduce global warming gas emissions in semiconductor manufacturing, and today is working with the European Union (EU) to discuss how the technology sector can help meet the EU's target of cutting greenhouse gas emissions by 20 percent by 2020.


• Intel is focused on reducing the natural resource use and waste by products of its manufacturing process. In the past 3 years, the company has saved more than 9 billion gallons of fresh water through conservation measures, and reduced its global warming gas emissions by the equivalent of removing 50,000 automobiles from the road.


• It has reduced hazardous materials in its products and recycles more than 70 percent of its chemical and solid wastes.


• Intel makes renewable energy a priority. The company is the single-largest purchaser of wind power in Oregon and the largest industrial consumer of renewable energy in New Mexico.


• Through Intel's ongoing conversion from 200mm to 300mm wafers, it has been able to reduce water consumption by approximately 40 percent for each square centimeter of silicon produced.


• Intel has been recognized by the U.S. Environmental Protection Agency for its work on Energy Star* and employee commuter programs.

For additional information about Intel's commitment to the environment, visit www.intel.com/go/responsibility.

View the complete Intel® Processors Go Lead-Free press kit at http://www.intel.com/pressroom/kits/45nm/leadfree.

Intel Unveils Virtual Marketing Storefront And Google Advertising Program For Reseller Channel

Intel Corporation today announced a new program that will help resellers worldwide market innovative Intel-based products in a more quick and cost-effective manner. The company has created a new virtual marketing storefront for its reseller channel and has also collaborated with Google to create an advertising program where resellers can place online ads.

The new initiative will provide qualified members of Intel's reseller channel network the resources and support to plan and execute marketing campaigns for their businesses. The online marketing storefront allows select resellers to place print ads, order merchandise and services, and easily customize collateral with their company information or logo. There will also be a suite of tools to support online advertising with Google, allowing reseller customers to go online and order ads by filing out a simple order form. Intel and Google will then facilitate the production and execution to simplify the process for the customer.

"We are listening to our customers who have asked for the ability to use online resources such as those offered by Google, in creative ways to help grow their business," said Steve Dallman, general manager, Intel Worldwide Reseller Channel Organization. "Many resellers are small businesses that have limited resources and expertise in marketing. Intel's virtual storefront will help customers overcome this challenge and equip them with the tools to be innovative in reaching and communicating to their customers."

The new virtual marketing storefront is being offered to Track Two licensees of the Intel® Inside program. It eliminates out-of-pocket expenses for Intel's channel customers through Intel Inside co-marketing funds. It also eliminates administration costs that were previously incurred by customers when applying for co-marketing reimbursements.

"We are excited about working together with Intel to bring the scale, relevancy and measurability of online advertising to Intel's small- to medium-sized channel partners around the globe," said John Topping, director, Technology BtoB Vertical, Google. "In leveraging Intel’s co-op marketing expertise, we have built tools and services to help Intel's channel partners more effectively manage their online advertising programs and generate better results from their marketing dollars."

Established in 1991, the Intel Inside program has always been a core element of Intel's worldwide marketing programs. The program has continued to evolve to better serve Intel's customers. The online advertising program established with Google reflects the growing importance of online ads in the marketing mix, especially for businesses customers.

The Intel Inside program is one of the world's largest co-operative marketing programs, supported by thousands of PC makers who are licensed to use the Intel Inside logos. The Intel brand is one of the top ten known-brands in the world, in a class with Coke*, Disney* and McDonalds*, according to various rankings.

The virtual marketing storefront and Google program will go into effect April 29. For more information resellers can contact their local Intel Reseller Channel Organization representative.

INTC: Intel To Build 300mm Wafer Fabrication Facility In China

Intel Corporation today announced plans to build a 300-millimeter (mm) wafer fabrication facility (fab) in the coastal Northeast China city of Dalian in Liaoning Province. The $2.5 billion investment for the factory designated Fab 68 will become Intel's first wafer fab in Asia and adds significant investment to Intel's existing operations in China.

"China is our fastest-growing major market and we believe it's critical that we invest in markets that will provide for future growth to better serve our customers," said Intel President and CEO Paul Otellini. "Fab 68 will be our first new wafer fab at a new site in 15 years. Intel has been involved in China for more than 22 years and over that time we’ve invested in excess of $1.3 billion in assembly test facilities and research and development. This new investment will bring our total to just under $4 billion, making Intel one of the largest foreign investors in China."

Not since 1992 with the construction of Fab 10 in Ireland has Intel built a fab from the ground up at a brand new site. Construction on Fab 68 is scheduled to begin later this year with production projected to begin in the first half of 2010. Initial production will be dedicated to chipsets to support Intel's core microprocessor business.

"This is one of the major cooperative projects between China and the United States in the area of integrated circuits manufacturing in recent years. The project will further strengthen Intel's leadership position in the semiconductor manufacturing in the world. At the same time, the investment in Dalian will have a positive impact to the regional economic development and the development of integrated circuits industry in the old industrial base of northeast China," said Zhang Xiaoqiang, vice chairman of the National Development and Reform Commission. "We welcome Intel and other multinational companies to invest and cooperate with China. We support Intel's initiative to expand and strengthen cooperation with relevant parties in a number of areas, such as talent training, technology standards, improved information technology for rural areas and digital health, to promote the mutual benefit and win-win of Intel and the information industry of China, and to achieve the goal of growing together."

Dalian Mayor Xia Deren said, "As an open city on China's coastline, Dalian provides many geographic advantages as well as existing infrastructure and services for foreign investment. We are very excited Intel has chosen Dalian to build a wafer fabrication facility. This investment will not just impact Dalian's social and economic development, but will generate a significant and positive impact on the economic and industrial structure in Northeast China."

When completed, Fab 68 will become part of Intel's manufacturing network that includes eight 300mm factories in 2010 with other fabs located in the United States, Ireland and Israel. Manufacturing with 300mm wafers dramatically increases the ability to produce semiconductors at a lower cost compared with more commonly used 200mm (eight-inch) wafers. The bigger wafers lower production cost per chip while diminishing overall use of resources. Using 300mm manufacturing technology consumes 40 percent less energy and water per chip than a 200mm wafer factory.

INTC: Intel Declares Regular Cash Dividend

Intel Corporation's board of directors has declared an 11.25 cents per share quarterly dividend on the company's common stock. The dividend is payable on June 1, 2007 to stockholders of record on May 7, 2007.

INTC: Intel Introduces Solid State Drive Product Line Based On Nand Flash Memory

Intel Corporation announced today its entry into solid state drives with the Intel® Z-U130 Value Solid-State Drive. Based on NAND flash memory with industry standard USB interfaces, the Intel Z-U130 Value Solid State Drive offers cost-effective, high-performance storage for a wide variety of computing and embedded platforms. With advantages over hard disk drive (HDD) or removable universal serial bus (USB) storage devices, Intel's Solid State Drives deliver faster boot times, embedded code storage, rapid data access and low-power storage alternatives for value PCs, routers, servers, gaming and industrial applications.

"Solid state drive technology offers many benefits over traditional hard disk drives including improved performance and reliability," said Randy Wilhelm, vice president and general manager of Intel's NAND Products Group. "The Intel solid state drive technology provides robust performance, while offering Intel's industry leading quality, validation and reliability for a wide variety of embedded applications."

The Intel Z-U130 Value Solid State Drive is the company's first solution in the Intel Value Solid State Drive family that will offer different industry standard interfaces and densities. The product comes in 1 Gigabyte (GB), 2GB, 4GB and 8GB densities. With fast reads of 28 megabytes (MB) per second and write speeds of 20 MB per second, this higher performing solid state drive is a faster storage alternative that speeds through common PC or embedded application operations such as locating boot code, operating systems and commonly accessed libraries.

The drives will also be used in a variety of Intel-based computing platforms, such as servers, emerging market notebooks and low-cost, fully featured PCs. In addition, it will be used in Intel embedded solutions for routers and point of sale terminals.

Intel's Z-U130 Value Solid State Drive will be distinguished from other solid state product offerings by its extensive validation, including more than 1,000 hours of accelerated reliability testing, and is expected to meet an average mean time between failure (MTBF) specification of five million hours. The product can be easily integrated into original design manufacturers' designs because of its USB 2.0 and 1.1 compliant interfaces, 2x5 USB connector and standard single-level cell NAND in thin small outline package (TSOP) devices. The company is also considering next-generation products that could incorporate cost-effective multi-level cell (MLC) technology.

INTC: Intel Marks Energy-Efficient Milestone With 50-Watt, High-Performing Quad-Core Server Processors

Further expanding its quad-core processor family line-up, Intel Corporation today announced two energy-efficient 50-watt server processors that represent a 35- to nearly 60-percent decrease in power from Intel's existing 80- and 120-watt quad-core server products.

As companies increasingly focus on reducing electricity bills and cooling costs associated with their computing needs, these new processors, requiring just 12.5 watts of power for each of the four cores or processing engines, deliver similar performance yet set a new standard in energy efficiency.

Intel has introduced 11 server, workstation and desktop PC quad-core processors since November.

Servers based on the new low-power, quad-core processors are designed for dense Internet datacenters, blade servers and industries such as financial services where the scale and density of servers are highly sensitive to power, real estate and cooling costs. The potential for cost savings by replacing aging infrastructure with Quad-Core Intel® Xeon® processors and deploying virtualization technology can be as much as $6,000 per year over the lifetime of each server based on Intel's own evaluations.**

In addition, these new processors represent a nearly ten-fold improvement in power consumption per core in just 1½ years.*** The company attributes this collective success to the merits of its breakthrough Intel® Core™ microarchitecture and aggressive design execution.

"Intel has really responded to the industry's call to deliver unprecedented breakthroughs for data center energy efficiency," said Kirk Skaugen, vice president of Intel's Digital Enterprise Group and general manager of the Server Platform Group. "IT managers can get outstanding quad-core Intel Xeon server performance today and at no premium to dual-core products. We are thrilled to drive further records in lower power consumption and we won't stop here. Our engineers and architects are passionate about delivering even more power-saving innovations down the road."

Intel is introducing two low-voltage processors: the Quad-Core Intel Xeon processor L5320 and L5310. The new 50-watt quad-core processors operate at 1.86 GHz and 1.60 GHz, respectively, feature a unique 8 megabytes (MB) of on die cache for faster memory data communication and run on dedicated 1066 MHz front side buses. In 1,000 unit quantities the L5320 is priced at $519 and the L5310 at $455.

These processors can be coupled with Intel's existing "Bensley" server platform and have been designed to be "drop-in" compatible with the existing Dual-Core and Quad-Core Intel Xeon processor families.

Servers based on these new processors are expected to be available worldwide over the next few months from Acer, Dell, Digital Henge, Fujitsu Siemens, HP, HCL, IBM, Rackable Systems, Samsung, Verari, Wipro and other companies.



* Other names and brands may be claimed as the property of others.

**Study: IT@Intel, Dec 2006. Can be found at www.intel.com/it/pdf/consolidate-using-quadcore.pdf

***Compared to 64bit Intel® Xeon® Processors at 110W TDP (110W per core)

INTC: Intel Announces Investment in Rio Rancho, New Mexico Site

Intel Corporation today announced that it will invest $1 billion to $1.5 billion in its Rio Rancho site to retool Fab 11X for production on Intel's next generation 45 nanometer (nm) manufacturing process. Fab 11X will be the company's fourth factory scheduled to use the 45nm process, with production in New Mexico scheduled to start in the second half of next year.

Marking one of the biggest advancements in fundamental transistor design in 40 years, Intel's 45nm high-k and metal gate process consists of an innovative combination of new transistor materials that drastically reduces transistor leakage and increases performance. When 45nm production begins later this year, the company will use a new material with a higher-k (dielectric constant), and a new combination of metal materials for the transistor gate electrode. Extending its lead over the rest of the semiconductor industry, early versions of Intel's next generation 45nm family of products - codenamed Penryn - are already running multiple operating systems and applications, and the company remains on track to begin 45nm production in the second half of this year.

"Our new 45 nanometer process represents one of the most significant manufacturing breakthroughs in decades and we believe that putting it in our factory in New Mexico will help us deliver the best possible products for our customers," said Paul Otellini, Intel Corporation's president and chief executive officer. "Our Rio Rancho site has successfully operated in New Mexico for 27 years. Based on that success, we are pleased to position Fab 11X for Intel's next generation of technology."

"We have worked hard to make New Mexico a center for new technology and this announcement is $1 billion worth of proof that our efforts are working," said Governor Bill Richardson. "This investment sends the message that Intel New Mexico will be here for years to come, and will manufacture some of the most advanced technology in the world."

"This decision by Intel to invest over $1 billion in its Rio Rancho facility is great news," said Senator Pete Domenici. "Intel has been an outstanding corporate citizen in New Mexico. By retooling its plant with the latest technology, the company is ensuring that it will have a major presence in our state for years to come - and a major impact on our economy. I welcome Intel's commitment, and I'm pleased that they will be continuing to benefit from our state's skilled workforce and commitment to innovation."

Initial production of Intel's 45nm products will be done at its Oregon development fab, D1D. The company is currently building two other factories that will use the 45nm process. The $3 billion Fab 32 in Chandler, Ariz., will commence production late this year; and the $3.5 billion Fab 28 in Kiryat Gat, Israel, will begin production the first half of next year.

Fab 11X currently manufactures 90nm computer chips on 300mm wafers. Fab 11X began production in October 2002 and was Intel's first 300mm, or 12 inch, high-volume manufacturing facility. It was also Intel's first fully automated, high volume factory producing 300mm wafers.

INTC:Intel Research Chip Advances 'Era Of Tera' 80-Core Programmable Processor First to Deliver Teraflop Performance with Remarkable Energy-Efficiency

Intel Corporation researchers have developed the world's first programmable processor that delivers supercomputer-like performance from a single, 80-core chip not much larger than the size of a finger nail while using less electricity than most of today's home appliances. This is the result of the company's innovative 'Tera-scale computing' research aimed at delivering Teraflop -- or trillions of calculations per second --performance for future PCs and servers. Technical details of the Teraflop research chip will be presented at the annual Integrated Solid State Circuits Conference (ISSCC) this week in San Francisco.

Tera-scale performance, and the ability to move terabytes of data, will play a pivotal role in future computers with ubiquitous access to the Internet by powering new applications for education and collaboration, as well as enabling the rise of high-definition entertainment on PCs, servers and handheld devices. For example, artificial intelligence, instant video communications, photo-realistic games, multimedia data mining and real-time speech recognition - once deemed as science fiction in Star Trek shows - could become everyday realities.

Intel has no plans to bring this exact chip designed with floating point cores to market. However, the company's Tera-scale research is instrumental in investigating new innovations in individual or specialized processor or core functions, the types of chip-to-chip and chip-to-computer interconnects required to best move data and most importantly, how software will need to be designed to best leverage multiple processor cores. This Teraflop research chip offered specific insights in new silicon design methodologies, high-bandwidth interconnects and energy management approaches.

"Our researchers have achieved a wonderful and key milestone in terms of being able to drive multi-core and parallel computing performance forward," said Justin R. Rattner, Intel's chief technology officer. "It points the way to the near future when Teraflop-capable designs will be commonplace and will reshape what we can all expect from our computers and the Internet at home and in the office."

The first time Teraflop performance was achieved was in 1996, on the ASCI Red Supercomputer built by Intel for the Sandia National Laboratory. That computer took up more than 2000 square feet, was powered by nearly 10,000 Pentium® Pro processors, and consumed over 500 kilowatts of electricity. Intel's research chip achieves this same performance on a multi-core chip that could rest on the tip of a finger.

Also remarkable is that this 80-core research chip achieves a teraflop of performance while consuming only 62 watts - less than many single-core processors today.

The chip features an innovative tile design in which smaller cores are replicated as "tiles," making it easier to design a chip with many cores. With Intel's discovery of new and robust materials to build future transistors and no immediate end in sight for Moore's Law, this lays a path to manufacture multi-core processors with billions of transistors more efficiently in the future.

The Teraflop chip also features a mesh-like "network-on-a-chip" architecture allowing super high bandwidth communications between the cores, and capable of moving Terabits of data per second inside the chip. The research also investigated methods to power cores on and off independently, so only the ones needed to complete a task are used, providing more energy efficiency.

Further Tera-scale research will focus on the addition of 3-D stacked memory to the chip as well as developing more sophisticated research prototypes with many general-purpose Intel® Architecture-based cores. Today, the Intel® Tera-scale Computing Research Program has over 100 projects underway that explore other architectural, software and system design challenges.

Intel is presenting eight other papers at ISSCC, including one which will cover the Intel® CoreTM micro-architecture and its use in dual and quad core processors spanning laptops to desktop PCs and servers, using both 65nm and revolutionary 45nm process technologies. Other papers cover such topics as a Radio Frequency Identification (RFID) reader transceiver chip, a low power cache for mobile applications, a reconfigurable Viterbi accelerator, as well as novel circuits for on-die supply resonance suppression, on-chip phase-noise measurement and adaptive techniques for variations and aging.

INTC: Intel and USAID Commit to Broaden Technology Access in Emerging Markets

Intel Corporation and the United States Agency for International Development (USAID) are working together to broaden access and usage of information and communications technology (ICT) in developing communities around the world. The organizations signed a memorandum of understanding (MOU), identifying three areas of common focus: increasing the use of ICT in education, enabling last mile Internet connectivity and supporting ICT usage by small- and medium-sized businesses to enhance economic development opportunities.

Intel and USAID share the belief of the importance of ICT in accelerating social and economic development in emerging markets. The two organizations have been working together to develop successful community projects in developing communities preceding the MOU, such as installing WiMAX technology in Vietnam. In 2006, Intel, USAID and Vietnam Data Communication Company worked together to install WiMAX technology in Lào Cai, a city in the mountainous, rural northern Vietnam where telecommunications services are limited. WiMAX offers access to cost-efficient broadband internet and Voice over IP telephony for Lào Cai's citizens, who depend on good communications to build robust economic relationships with neighboring trading partners. Successful project engagements and technology deployments such as these help create a model from which Intel and USAID plan to extend that relationship more broadly.

"This cooperation brings together USAID's extensive network and experience in developing communities with Intel's technology leadership and strong relationship with local industries in emerging markets," said John Davies, vice president of the Intel World Ahead Program. "Synergy from the strengths of the two organisations will amplify our individual efforts in using technology as the catalyst for growth in developing communities, expanding what's possible for citizens in these communities."

"USAID believes in the long-term and sustainable benefits that information and communications technologies bring to developing communities around the world," said Juan Belt, director for Office of Infrastructure and Engineering, USAID. "Our collaboration with Intel exemplifies the importance of public-private partnerships to more broadly extend the benefits of ICT to underserved communities. These benefits include improvements to the business environment, education opportunities, availability of medical services and ultimately the lives of citizens in these communities."

Intel's involvement with USAID is part of the Intel World Ahead Program - the company's comprehensive approach aimed at bringing uncompromised technology to everyone, anywhere in the world, integrating and extending the company's efforts to advance progress in four areas: accessibility to PCs, connectivity, education and content.

INTC: New Intel Wireless Product for Laptops Extends Networking Speed and Range

Intel Corporation today introduced the Intel® Next-Gen Wireless-N network connection, an upgrade to the wireless component found inside Intel® Centrino® Duo mobile technology and other Intel-based laptops that helps consumers better connect to wireless networks.

As notebook PCs increasingly download broadband-intense content such as movies, videos and music, a more powerful networking solution is needed. Based on the draft 802.11n Wi-Fi specification, the Intel Next-Gen Wireless-N technology addresses that need by offering users up to five times** the performance and twice the wireless range – while providing up to an extra hour of notebook battery life when compared to existing Draft-N products.**

In addition, Intel said it has initiated the "Connect with Centrino" program. Through this program, Intel has worked with leading access point (AP) vendors including Asus, Belkin, Buffalo, D-Link and Netgear to better ensure compatibility and performance. Intel's wireless-N product is certified to work with multiple APs and as these AP's successfully pass Intel's rigorous real-world testing certification criteria, they will display a "Connect with Centrino" identifier on their product packaging, allowing consumers a choice for connecting with more confidence.

"Integrating wireless-N technology into notebook computers based on Centrino Duo with the Intel® Core™ 2 Duo processor delivers the speed, coverage and multi-tasking abilities needed for consumers to enjoy their home networking and digital entertainment," said Dave Hofer, director of wireless marketing for Intel's Mobile Platforms Group. "Additionally, access points that are identified by our new 'Connect with Centrino' logo assure consumers that they are purchasing a compatible wireless-N system."

The new wireless-N technology improves the home network experience – especially when multiple people access their wireless network simultaneously and enjoy bandwidth consuming applications such as audio and video entertainment. Intel's Next-Gen Wireless-N product reduces "dead spots" in the home; optimizes high-definition (HD) entertainment experiences such as streaming HD movies; improves battery life and provides the benefit of working with existing 802.11 a/b/g access points.

Intel Centrino Duo mobile technology-based laptops operate faster and more efficiently with Intel Next-Gen Wireless-N enhanced wireless communication capabilities. At the heart of the platform, the Intel Core 2 Duo processors have two processing cores – or computing "brains" – that can handle multiple tasks in less time while consuming less power. When integrated into Intel Centrino Duo-based systems running wireless-N, the Intel Core 2 Duo processors can improve viewing and playing back HD video, speed up conversion of songs into a digital format to upload to an MP3 player, and more quickly run the latest virus protection updates.

Intel Next-Gen Wireless-N technology as well as the "Connect with Centrino" identifier will be delivered in conjunction with new notebook computers powered by Intel Centrino Duo mobile technology from OEMs such as Acer, Asus, Gateway and Toshiba that are being distributed with Microsoft Windows Vista beginning in late January and other OEMs to follow.


* Other names and brands may be claimed as the property of others.

**Based on the theoretical bandwidth maximum enabled by 2x3 Draft N implementations with 2 spatial streams. Actual throughput will vary depending on your specific operating system, hardware and software configurations. Check with your PC manufacturer for details.

**References to improved battery life as measured by MobileMark* 2005, refer to comparisons with previous generation Intel® Centrino® Duo mobile technology with Intel® PRO/Wireless 3945ABG Network Connection. Actual platform battery life savings will vary depending on your specific operating system, hardware and software configurations. Check with your PC manufacturer for details.

**References to improved battery life as measured by MobileMark* 2005, refer to comparisons with previous generation Intel® Centrino® Duo mobile technology with Intel® PRO/Wireless 3945ABG Network Connection. Actual throughput and platform battery life savings will vary depending on your specific operating system, hardware and software configurations. Check with your PC manufacturer for details.

Sun(SUNW) And Intel(INTC) Announce Landmark Agreement

Sun Microsystems, Inc. (Nasdaq: SUNW) and Intel Corporation today announced a broad strategic alliance centered on Intel's endorsement of the Solaris Operating System (OS) and Sun's commitment to deliver a comprehensive family of enterprise and telecommunications servers and workstations based on Intel Xeon processors. The scope of the agreement spans Solaris, Java and NetBeans software and Intel Xeon microprocessors, as well as other Intel and Sun enterprise-class technologies. The alliance also includes joint engineering, design and marketing efforts.


As part of today's announcement, Intel is embracing Solaris as a mainstream OS and the enterprise class, mission critical UNIX OS for Intel Xeon processor-based servers. Intel also endorses Sun's Solaris, Java and NetBeans products and will actively support the OpenSolaris and open Java communities from which they continue to evolve.

Sun is committed to leading on performance and energy efficiency in its server product line. After a comprehensive evaluation of industry platform solutions, Sun has decided to complement its current offerings with platforms based on Intel Architecture optimized for Solaris beginning in the first half of 2007. Sun believes Intel's model of alternating new microarchitectures with new process technologies on an annual basis will offer outstanding building blocks for Sun's customers.

Sun plans to deliver a comprehensive family of Intel-based systems with uni-, dual- and multi-processor based servers and workstations supporting Solaris, Windows and Linux. Intel and Sun will also collaborate around greater than four processor scale-up systems optimized for the Solaris OS.

"We're excited about Intel's long term Xeon road map and the performance we're seeing with Solaris and Sun Java on the Xeon platforms," said Jonathan Schwartz, president and CEO, Sun Microsystems, Inc. "And Intel's endorsement for and agreement to OEM Solaris opens markets for both of us across the world. This is truly a landmark relationship for the industry."

"We're thrilled to be working with Sun to make Solaris on Intel Xeon processors a great solution for our enterprise customers worldwide," said Paul Otellini, president and CEO, Intel. "Bringing together the best technologies from both Sun and Intel will result in innovative products for years to come."

As part of this alliance, Intel has signed a Solaris OEM agreement enabling Intel to distribute and support the Solaris OS to its customers as market opportunities may arise and consistent with Intel's product strategies. Intel and Sun will strongly encourage independent software vendors (ISVs) and system providers to expand their offerings for Solaris on Intel-based systems, and Intel will support Sun in its efforts to optimize applications for Solaris on Intel Xeon processor-based systems.

Intel and Sun also believe that the combination of Sun's open source Solaris and Java development environments and the Intel architecture provide a solid platform for ISVs to develop and deliver applications and web services to deliver outstanding differentiated value to enterprise customers. The Solaris platform is supported by more than 2000 ISVs on 800+ platforms that deliver the essential scaling, functionality and security capable of handling explosive network growth.

Both companies expect this alliance to expand the reach of Intel Xeon processor and Solaris OS based solutions. Solaris adoption will be driven by the Intel Xeon processor's significant market presence and in turn Solaris will give Intel a broader presence in the datacenter, virtualization and high performance computing space. The two companies will also work together on the rapid adoption of key enterprise-class Intel and Sun technologies for Sun's systems based on Intel Xeon processors including Intel Virtualization Technology, Intel IO Acceleration Technology (IOAT) and Intel Demand Based Switching.

Information about the Solaris OS can be found at www.sun.com/solaris. It can also be downloaded and used for free at www.sun.com/software/solaris/get.jsp

Information about the NetBeans integrated development environment, which can also be downloaded and used for free, can be found at www.netbeans.org

Information about Intel Xeon processors can be found at www.intel.com/products/processor/xeon/

INTC: Intel Declares Regular Cash Dividend

Intel Corporation's board of directors has declared an 11.25 cents per share quarterly dividend on the company's common stock. The dividend is payable on Mar. 1, 2007 to stockholders of record on Feb. 7, 2007.

In November the company announced a 12.5 percent increase in its quarterly dividend to 11.25 cents per share ($0.45 per share on an annual basis).

INTC: Intel Fourth-Quarter Revenue $9.7 Billion

Intel Corporation today announced fourth-quarter revenue of $9.7 billion, operating income of $1.5 billion, net income of $1.5 billion and earnings per share (EPS) of 26 cents. Excluding the effects of share-based compensation, the company posted operating income of $1.8 billion, net income of $1.7 billion and EPS of 30 cents.

Fourth-quarter results included a gain from the sale of certain assets of the company's communications and application processor business to Marvell Technology Group partially offset by impairments, including an impairment for the related decision to place the company's Fab 23 facility in Colorado Springs, Colo., up for sale. The gain and impairments resulted in a net increase to EPS of approximately 2.5 cents. Fourth-quarter restructuring charges related to the company's structure and efficiency program were in line with the company's expectations and decreased EPS by approximately 1.5 cents.

"Intel's product and technology leadership yielded a strong fourth quarter with higher selling prices and record unit shipments in the fastest growing segments of the market," said Intel President and CEO Paul Otellini.


Click here to continue reading the Q4 2006 Earnings Release (PDF 278KB)

Earnings Webcast
Intel will hold a public webcast at 2:30 p.m. PST today on its Investor Relations Web site at www.intc.com, with a replay available until Jan. 30.

INTC: Intel, Eros Take On-Demand Bollywood Entertainment Worldwide

Accelerating the availability of on-demand, broadband-delivered entertainment to PCs connected to TVs, Intel Corporation and Eros International, today announced the debut of Eros' premium Bollywood service on Intel® Viiv™ technology-based PCs. Eros International is a London AIM-listed leading studio and distribution house within the Indian film industry known as "Bollywood."

Accenting the new service's availability, the companies announced plans for the pre-DVD online premiere of "I See You," a top Bollywood film within weeks of its global theatrical release.

At the Consumer Electronics Show (CES), Eros and Intel demonstrated the new service which delivers access to one of the largest and most compelling online selections of Bollywood entertainment, including high-definition movies, music videos, day and date premieres, evergreen blockbusters and timeless classics, from the Web to Intel Viiv technology-based PCs for viewing and enjoyment on large screen TVs. The Eros service will offer rental, subscription, download to own at launch and even download to burn models in the future.

"Our effort with Intel will give us the opportunity to serve an even broader audience worldwide, enter new markets and gain new revenue streams, while exploring and embracing a variety of exciting new digital distribution technologies, such as Intel Viiv technology," said Kishore Lulla, Chairman and CEO of Eros. "We are a content company that believes in empowering consumers so they can watch what they want, when they want, how they want."

"Through Intel Viiv technology and our collaboration with Eros, we're bringing the world directly into consumers' living rooms at the touch of a button," said Kevin Corbett, vice president, Intel's Digital Home Group and general manager of the Content Services Group. "Intel's goal is to accelerate the availability of broadband-delivered entertainment into every home. And, with Intel Viiv technology, we're helping to change the economics of distribution and allow more people around the world to enjoy exciting content, irrespective of their physical location."

Building on the availability of the 'Bollywood' service, Eros will debut the broadband premiere of "I See You" starring Arjun Rampal, on Intel Viiv technology based PCs within weeks of its global theatrical release on Dec. 29 and ahead of its release on DVD.

Intel Viiv technology-based PCs powered by Intel Core™ 2 Duo processors deliver a best-in-class entertainment media PC experience. The technology helps connect the PC and TV, and enables consumers to access, manage, share and enjoy a growing assortment of digital entertainment, including Hollywood movies, TV shows, music videos, sports, games and more.

About Eros Group

Eros International plc, an integrated media and entertainment company, is a global player in the Bollywood arena. Being integrated across the value chain means Eros produces Bollywood films as well as distributes them globally through all available windows - theatres, home entertainment, television and new media channels. Eros has also nurtured a Hollywood home video market for India.

Established in 1977, Eros has three decades of market leadership in the multi billion dollar sector that is experiencing a double digit growth. Eros operates in over 50 countries with worldwide offices in India, UK, USA, Dubai, Australia, Fiji and Isle of Man. It has built a business model combining the release of 25-30 new films every year with the exploitation of a valuable film library containing more than 1,300 titles making it one of the largest content owners in the business.

Some of Eros's new media alliance partners are Intel Corporation, Comcast Cable, Movielink, Rogers Cable and RTL Holland.